Inventor
FUKE WANG
Inventor
SG
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B33Yprimary
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering15%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds15%
B29CShaping or joining of plastics12%
C08LCompositions of macromolecular compounds12%
A61KPreparations for medical, dental or toiletry purposes8%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts8%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients8%
A61CDentistry4%
B29LIndexing scheme associated with subclass b29c, relating to particular articles4%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds4%
PatentTitleYear
12,269,909Polymer composition and a method of preparing a polymer resin202512,258,449Photocurable compositions having variable viscosities202512,262,505Additive manufacturing system for three-dimensional printing202512,214,545Three-dimensional printing method202512,195,6183D printable resin compositions202511,240,740Method for processing radio frequency resources and terminal2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to HUAWEI TECH CO LTD (1)· patent assignee history
2022Based in CN· patent location history
2025Patents assigned to AGENCY SCIENCE TECH & RES (5)· patent assignee history
2025Based in SG· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AGENCY SCIENCE TECH & RES | 5 | 2025 |
| HUAWEI TECH CO LTD | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| SG | 5 | 2025 |
| CN | 1 | 2022 |