Inventor
Richard DISCHLER
Inventor
US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H05KPrinted circuits18%
H01PWaveguides12%
G01MTesting static or dynamic balance of machines or structures6%
G06FElectric digital data processing6%
H04BTransmission6%
H10DInorganic electric semiconductor devices6%
PatentTitleYear
12,442,712Liquid cooling system leak detection improvements202512,150,271Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device202411,716,826Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device202311,656,662Layered super-reticle computing : architectures and methods202311,581,272Contactless high-frequency interconnect2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to INTEL CORP (5)· patent assignee history
2023–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 5 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 5 | 2023–2025 |