Inventor

Jer-Haur Kuo

Inventor

Taipei, TW

Overview

25→

Patents

2009–2013

Patent span

Mechanical engineering

Primary field (CPC F)

Patents· 25 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%

F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted16%

F21VFunctional features or details of lighting devices or systems thereof14%

F21KNon-electric light sources using luminescence9%

F04DNon-positive-displacement pumps7%

F21SNon-portable lighting devices7%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%

F28FDetails of heat-exchange and heat-transfer apparatus, of general application5%

G02BOptical elements, systems or apparatus3%

H10HInorganic light-emitting semiconductor devices having potential barriers3%

PatentTitleYear

8,585,359'Heat dissipation device and centrifugal fan thereof'2013 8,550,781'Heat dissipation fan and rotor thereof'2013 8,534,998'Centrifugal fan'2013 8,328,533'Heat dissipation fan'2012 8,323,002'Heat dissipation device and fan assembly thereof'2012 8,122,945'Heat dissipation device with base having fasteners'2012 8,118,081'Heat dissipation device with locking tabs'2012 8,050,035'Heat dissipation device'2011 7,967,473'LED lamp with heat sink'2011 7,916,485'Fin-type heat sink and electronic device using same'2011 7,891,839'LED lamp'2011 7,881,061'Mounting device for mounting heat sink onto electronic component'2011 7,857,615'Injection mold having a buffer region'2010 7,845,838'Light emitting diode lamp'2010 7,794,111'White light illuminator and reading lamp using the same'2010 7,794,127'Light emitting diode having grooves to modulate light emission thereof'2010 7,794,118'Light emitting diode assembly'2010 7,746,646'Securing device for assembling heat dissipation module onto electronic component'2010 7,697,295'Heat sink clip'2010 7,661,853'Light emitting diode lamp'2010 7,654,702'LED lamp'2010 7,639,504'Mounting device for mounting heat sink onto electronic component'2009 7,611,263'Light source module with a thermoelectric cooler'2009 7,613,005'Mounting device for mounting heat sink onto electronic component'2009 7,488,093'LED lamp with a cover and a heat sink'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2013Patents assigned to FOXCONN TECH CO LTD (25)· patent assignee history

2009–2013Patents assigned to FU ZHUN PRECISION IND SHENZHEN (22)· patent assignee history

2009–2013Based in Taipei, TW· patent location history

2012–2013Patents assigned to KUO JER-HAUR (7)· patent assignee history

2012–2013Patents assigned to YU FANG-XIANG (4)· patent assignee history

2012–2013Patents assigned to ZHA XIN-XIANG (4)· patent assignee history

2013Based in Tu-Cheng, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
FOXCONN TECH CO LTD	25	2009–2013
FU ZHUN PRECISION IND SHENZHEN	22	2009–2013
KUO JER-HAURself	7	2012–2013
YU FANG-XIANG	4	2012–2013
ZHA XIN-XIANG	4	2012–2013

Locations

Location	Patents	Span
Taipei, TW	24	2009–2013
Tu-Cheng, TW	1	2013