Inventor
Kentaro Hirai
Inventor
Aichi, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
B24BMachines, devices, or processes for grinding or polishing11%
C09JAdhesives11%
H01RElectrically-conductive connections11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%
Y10TTechnical subjects covered by former us classification11%
PatentTitleYear
10,355,404Housing of board connector, board connector and board connector with case20196,730,595'Protecting method for semiconductor wafer and surface protecting adhesive film for semiconductor wafer used in said method'20046,273,791'Method of producing semiconductor wafer'20016,159,827'Preparation process of semiconductor wafer'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2004Patents assigned to MITSUI CHEMICALS INC (3)· patent assignee history
2000–2001Based in Aichi, JP· patent location history
2004Based in Miyagi, JP· patent location history
2019Patents assigned to SUMITOMO WIRING SYSTEMS (1)· patent assignee history
2019Based in Mie, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUI CHEMICALS INC | 3 | 2000–2004 |
| SUMITOMO WIRING SYSTEMS | 1 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Aichi, JP | 2 | 2000–2001 |
| Mie, JP | 1 | 2019 |
| Miyagi, JP | 1 | 2004 |