Inventor
Chi-Hui Lai
Inventor
Taichung, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
B29CShaping or joining of plastics6%
G06FElectric digital data processing6%
H01GCapacitors6%
H01RElectrically-conductive connections6%
H05KPrinted circuits6%
H10DInorganic electric semiconductor devices6%
PatentTitleYear
11,009,914Electronic device202110,861,841Semiconductor device with multiple polarity groups202010,840,227Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device202010,832,985Sensor package and method202010,790,269Semiconductor devices and semiconductor structures202010,658,348Semiconductor devices having a plurality of first and second conductive strips2020Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2020Based in Taichung, TW· patent location history
2020Based in Hsinchu, TW· patent location history
2021Patents assigned to PEGATRON CORP (1)· patent assignee history
2021Based in Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2020 |
| PEGATRON CORP | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taichung, TW | 4 | 2020 |
| Taipei, TW | 1 | 2021 |
| Hsinchu, TW | 1 | 2020 |