Inventor
SEIJI TAKE
Inventor
JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Qprimary
H01QAntennas, i.e. radio aerials43%
H05KPrinted circuits43%
H01BCables14%
PatentTitleYear
12,593,395Wiring board and method for manufacturing wiring board202612,424,752Wiring board and method for manufacturing wiring board202512,156,337Wiring board and method for manufacturing wiring board202412,107,327Wiring board and method for manufacturing wiring board202411,916,285Wiring board and method for manufacturing wiring board202411,705,624Wiring board and method for manufacturing wiring board2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to DAINIPPON PRINTING CO LTD (6)· patent assignee history
2023–2026Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DAINIPPON PRINTING CO LTD | 6 | 2023–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 6 | 2023–2026 |