Inventor
JAECHOON KIM
Inventor
KR
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
B22FWorking metallic powder8%
C09KMaterials for miscellaneous applications, not provided for elsewhere8%
H10DInorganic electric semiconductor devices8%
H05KPrinted circuits4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
12,506,047Semiconductor package and cooling system202512,431,403Semiconductor package including thermal interface material (TIM) layers on semiconductor chips202512,388,048Semiconductor package comprising heat spreader202512,243,803Thermal interface material, method of manufacturing the same, and semiconductor packages including the same202512,237,268Integrated circuit semiconductor device202512,199,002Semiconductor package and method of manufacturing the same202512,009,303Integrated circuit semiconductor device202411,935,812Thermal interface material and semiconductor packages including the same2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2025Patents assigned to SAMSUNG ELECTRONICS CO LTD (8)· patent assignee history
2024–2025Patents assigned to UNIV INDUSTRY COOPERATION GROUP KYUNG HEE UNIV (2)· patent assignee history
2024–2025Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 8 | 2024–2025 |
| UNIV INDUSTRY COOPERATION GROUP KYUNG HEE UNIV | 2 | 2024–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 8 | 2024–2025 |