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Inventor

Kun-Chih Chan

Inventor
Hsinchu, TW

Overview

3→
Patents
2014–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Rprimary
G01RMeasuring electric variables17%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them17%
H01LSemiconductor devices17%
H10NElectric solid-state devices not otherwise provided for17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
PatentTitleYear
10,935,877Projection apparatus and heat dissipation control method20219,250,288'Wafer-level testing method for singulated 3D-stacked chip cubes'20168,703,508'Method for wafer-level testing diced multi-chip stacked packages'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2016Patents assigned to POWERTECH TECHNOLOGY INC (2)· patent assignee history
2014Patents assigned to CHAN KUN-CHIH (1)· patent assignee history
2014Patents assigned to CHANG KAI-JUN (1)· patent assignee history
2014Patents assigned to CHEN SHIN-KUNG (1)· patent assignee history
2014–2021Based in Hsinchu, TW· patent location history
2021Patents assigned to CORETRONIC CORP (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
POWERTECH TECHNOLOGY INC22014–2016
CHAN KUN-CHIHself12014
CHANG KAI-JUN12014
CHEN SHIN-KUNG12014
CORETRONIC CORP12021
Locations
LocationPatentsSpan
Hsinchu, TW32014–2021