Inventor
Akiji Shibata
Inventor
Hitachi, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H05KPrinted circuits20%
G08CTransmission systems for measured values, control or similar signals10%
H04JMultiplex communication10%
Y02PClimate change mitigation technologies in the production or processing of goods10%
Y10TTechnical subjects covered by former us classification10%
PatentTitleYear
7,626,126'Multilayer semiconductor device'20097,355,278'Mold die for a semiconductor device'20087,213,335'Method for manufacturing printed circuit boards'20076,940,161'Semiconductor device and process for producing the same'20055,182,667'Method of receiving wavelength multiplex signals'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2009Patents assigned to HITACHI CABLE (5)· patent assignee history
1993–2009Based in Hitachi, JP· patent location history
2005Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI CABLE | 5 | 1993–2009 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hitachi, JP | 4 | 1993–2009 |
| Tokyo, JP | 1 | 2005 |