Inventor
HUNG-CHAO KAO
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices23%
H10DInorganic electric semiconductor devices23%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H10BElectronic memory devices15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H10NElectric solid-state devices not otherwise provided for4%
PatentTitleYear
12,477,756Metal-insulator-metal structure and methods of fabrication thereof202512,389,612Method of forming a stress reduction structure for metal-insulator-metal capacitors202512,310,252Semiconductor memory structure and method for forming the semiconductor memory structure202511,923,405Metal-insulator-metal structure and methods of fabrication thereof202411,532,695Stress reduction structure for metal-insulator-metal capacitors202211,342,408Metal-insulator-metal structure and methods of fabrication thereof202211,222,946Semiconductor device including a high density MIM capacitor and method2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (7)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 7 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 7 | 2022–2025 |