Inventor
REN-DOU LEE
Inventor
TW
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
B24BMachines, devices, or processes for grinding or polishing12%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems12%
B25JManipulators8%
B29CShaping or joining of plastics8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
B81BMicrostructural devices or systems, e.g. micromechanical devices4%
C09GPolishing compositions4%
PatentTitleYear
12,234,145Methods for wafer bonding202512,138,735Multi-layered windows for use in chemical-mechanical planarization systems202411,850,702Chemical mechanical planarization membrane202311,851,325Methods for wafer bonding202311,688,620Shiftless wafer blades202311,380,569Shiftless wafer blades202211,267,099Chemical mechanical planarization membrane202211,192,778MEMS package with roughend interface2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (8)· patent assignee history
2021–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 8 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 8 | 2021–2025 |