Inventor
Donald I. Mead
Inventor
Montrose, PA, US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
Y10TTechnical subjects covered by former us classification20%
B23KSoldering or unsoldering16%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
PatentTitleYear
7,101,782'Method of making a circuitized substrate'20067,037,819'Method of making a circuitized substrate'20066,818,988'Method of making a circuitized substrate and the resultant circuitized substrate'20046,524,888'Method of attaching a conformal chip carrier to a flip chip'20036,513,701'Method of making electrically conductive contacts on substrates'20036,337,509'Fixture for attaching a conformal chip carrier to a flip chip'20026,173,887'Method of making electrically conductive contacts on substrates'20015,941,449'Method of making an electronic package having spacer elements'19995,762,258'Method of making an electronic package having spacer elements'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2006Patents assigned to IBM (9)· patent assignee history
1998–2006Based in Montrose, PA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 9 | 1998–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Montrose, Pennsylvania, US | 9 | 1998–2006 |