Inventor
Tsukasa Shiraishi
Inventor
Osaka, JP
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1037%
H05KPrinted circuits27%
Y10TTechnical subjects covered by former us classification14%
Y02PClimate change mitigation technologies in the production or processing of goods6%
B01DSeparation4%
H03HImpedance networks, e.g. resonant circuits4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
A61FFilters implantable into blood vessels2%
H01LSemiconductor devices2%
PatentTitleYear
9,076,752'Semiconductor device and method for manufacturing the same'20158,822,753'Absorbent article'20148,353,102'Wiring board connection method'20138,063,486'Circuit board, method for manufacturing the same, and semiconductor device'20117,963,310'Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive connection film'20117,850,803'Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive correction film'20107,752,749'Electronic component mounting method and electronic component mounting device'20107,649,267'Package equipped with semiconductor chip and method for producing same'20106,909,180'Semiconductor device, mounting circuit board, method of producing the same, and method of producing mounting structure using the same'20056,818,461'Method of producing mounting structure and mounting structure produced by the same'20046,756,663'Semiconductor device including wiring board with three dimensional wiring pattern'20046,694,613'Method for producing a printed-circuit board having projection electrodes'20046,525,414'Semiconductor device including a wiring board and semiconductor elements mounted thereon'20036,452,280'Flip chip semiconductor apparatus with projecting electrodes and method for producing same'20026,429,382'Electrical mounting structure having an elution preventive film'20026,369,450'Method of producing mounting structure and mounting structure produced by the same'20026,300,576'Printed-circuit board having projection electrodes and method for producing the same'20016,284,640'Manufacturing method for semiconductor device, mounting method of semiconductor device, semiconductor device, and inspecting method of semiconductor device'20016,154,940'Electronic part and a method of production thereof'20005,920,142'Electronic part and a method of production thereof'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2005Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (12)· patent assignee history
1999–2005Based in Takatsuki, JP· patent location history
2001–2015Based in Osaka, JP· patent location history
2010–2015Patents assigned to PANASONIC CORP (7)· patent assignee history
2011–2014Patents assigned to SHIRAISHI TSUKASA (3)· patent assignee history
2011Patents assigned to HIRANO KOICHI (1)· patent assignee history
2014Patents assigned to KAWAKAMI YUSUKE (1)· patent assignee history
2014Based in Kagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 12 | 1999–2005 |
| PANASONIC CORP | 7 | 2010–2015 |
| SHIRAISHI TSUKASAself | 3 | 2011–2014 |
| HIRANO KOICHI | 1 | 2011 |
| KAWAKAMI YUSUKE | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 14 | 2001–2015 |
| Takatsuki, JP | 5 | 1999–2005 |
| Kagawa, JP | 1 | 2014 |