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Inventor

THOMAS J. STROTHMANN

Inventor
US

Overview

2→
Patents
2022–2024
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
PatentTitleYear
11,961,764Semiconductor device and method of making a wafer-level chip-scale package202411,257,729Semiconductor device and method of forming encapsulated wafer level chip scale package (eWLCSP)2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022Patents assigned to JCET SEMICONDUCTOR SHAOXING CO LTD (1)· patent assignee history
2022–2024Based in US· patent location history
2024Patents assigned to STATS CHIPPAC PTE LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
JCET SEMICONDUCTOR SHAOXING CO LTD12022
STATS CHIPPAC PTE LTD12024
Locations
LocationPatentsSpan
US22022–2024