Inventor
Yasuyoshi Horikawa
Inventor
Nagano, JP
Overview
Patents· 28 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H05KPrinted circuits22%
H01LSemiconductor devices11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
Y10TTechnical subjects covered by former us classification7%
H10HInorganic light-emitting semiconductor devices having potential barriers6%
H01GCapacitors5%
H01FMagnets4%
H01RElectrically-conductive connections4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
PatentTitleYear
10,395,810Inductor201910,115,878Optical sensor201810,062,490Method of manufacturing an inductor20189,721,884'Inductor device and method of manufacturing the same'20179,603,253'Wiring substrate, manufacturing method therefor, and semiconductor package'20179,590,154'Wiring substrate and light emitting device'20179,324,929'Wiring substrate'20169,282,629'Wiring substrate and semiconductor package'20169,159,648'Wiring substrate and manufacturing method thereof'20159,084,372'Wiring substrate, light emitting device, and manufacturing method of wiring substrate'20159,006,894'Wiring board and light emitting device'20158,770,987'Connecting terminal structure, manufacturing method of the same and socket'20148,708,711'Connecting terminal structure, socket and electronic package'20148,708,713'Connecting terminal structure, manufacturing method of the same and socket'20148,419,442'Socket and method of fabricating the same'20137,414,309'Encapsulated electronic part packaging structure'20087,402,900'Semiconductor device substrate, semiconductor device, and manufacturing method thereof'20087,358,114'Semiconductor device substrate, semiconductor device, and manufacturing method thereof'20087,358,591'Capacitor device and semiconductor device having the same, and capacitor device manufacturing method'20087,319,049'Method of manufacturing an electronic parts packaging structure'20087,276,438'Method of manufacturing wiring substrate'20077,229,856'Method of manufacturing electronic part packaging structure'20077,223,652'Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device'20077,072,168'Capacitor device and method of manufacturing the same'20067,038,904'Capacitor and method of producing same'20066,998,308'Substrate for carrying a semiconductor chip and a manufacturing method thereof'20066,897,544'Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device'20056,783,652'Process for manufacturing a wiring board'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2019Patents assigned to SHINKO ELECTRIC IND CO (27)· patent assignee history
2004–2019Based in Nagano, JP· patent location history
2013–2014Patents assigned to HORIKAWA YASUYOSHI (3)· patent assignee history
2013Patents assigned to IHARA YOSHIHIRO (1)· patent assignee history
2013Patents assigned to MOCHIZUKI KENJI (1)· patent assignee history
2013Patents assigned to TANAKA MASATO (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINKO ELECTRIC IND CO | 27 | 2004–2019 |
| HORIKAWA YASUYOSHIself | 3 | 2013–2014 |
| IHARA YOSHIHIRO | 1 | 2013 |
| MOCHIZUKI KENJI | 1 | 2013 |
| TANAKA MASATO | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nagano, JP | 28 | 2004–2019 |