Inventor
SANGSU HA
Inventor
KR
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables11%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy11%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution11%
PatentTitleYear
12,459,770Auto splicing device and auto splicing method for electrode202511,784,139Package substrate and semiconductor package including the same202311,749,630Interconnect structure and semiconductor chip including the same202311,342,283Package substrate and semiconductor package including the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2023Patents assigned to SAMSUNG ELECTRONICS CO LTD (3)· patent assignee history
2022–2025Based in KR· patent location history
2025Patents assigned to LG ENERGY SOLUTION LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 3 | 2022–2023 |
| LG ENERGY SOLUTION LTD | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 4 | 2022–2025 |