Inventor
CHENG-CHIEH LI
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H10DInorganic electric semiconductor devices11%
G06FElectric digital data processing6%
PatentTitleYear
12,538,559Semiconductor packages and methods of forming202612,368,132Joint structure in semiconductor package and manufacturing method thereof202512,087,727Joint structure in semiconductor package and manufacturing method thereof202411,502,056Joint structure in semiconductor package and manufacturing method thereof202211,226,708Touch electrode, touch panel, and touch display of using the same202211,164,855Package structure with a heat dissipating element and method of manufacturing the same202111,152,330Semiconductor package structure and method for forming the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (6)· patent assignee history
2021–2026Based in TW· patent location history
2022Patents assigned to TPK ADVANCED SOLUTIONS INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 6 | 2021–2026 |
| TPK ADVANCED SOLUTIONS INC | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 7 | 2021–2026 |