Inventor
Hiroo Kurosaki
Inventor
Nagahama, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests19%
Y10TTechnical subjects covered by former us classification19%
Y02PClimate change mitigation technologies in the production or processing of goods13%
F01DNon-positive displacement machines or engines, e.g. steam turbines6%
F05DIndexing scheme for aspects relating to non-positive-displacement machines or engines, gas-turbines or jet-propulsion plants6%
PatentTitleYear
11,125,086Rotor blade and axial flow rotating machine with the same20217,334,324'Method of manufacturing multilayer wiring board'20087,022,399'Semiconductor device integrated multilayer wiring board'20066,797,367'Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2008Patents assigned to MITSUBISHI PLASTICS INC (3)· patent assignee history
2004–2008Patents assigned to SONY CORP (2)· patent assignee history
2004–2008Based in Nagahama, JP· patent location history
2021Patents assigned to MITSUBISHI HEAVY IND LTD (1)· patent assignee history
2021Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI PLASTICS INC | 3 | 2004–2008 |
| SONY CORP | 2 | 2004–2008 |
| MITSUBISHI HEAVY IND LTD | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nagahama, JP | 3 | 2004–2008 |
| Tokyo, JP | 1 | 2021 |