Inventor
Takahiro Setaka
Inventor
Kawasaki, JP
Overview
Patents· 1 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B32Bprimary
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form20%
C09JAdhesives20%
H01LSemiconductor devices20%
H05KPrinted circuits20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
PatentTitleYear
9,962,915Bonding method and bonding apparatus2018Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2018Patents assigned to TOKYO OHKA KOGYO CO LTD (1)· patent assignee history
2018Based in Kawasaki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO OHKA KOGYO CO LTD | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 1 | 2018 |