LexDanaLexDanabeta
Inventor

Tsubasa Kondo

Inventor
Tokyo, JP

Overview

1→
Patents
2019
Patent span
Performing operations
Primary field (CPC B)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B32Bprimary
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form17%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables17%
H01LSemiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests17%
Y10TTechnical subjects covered by former us classification17%
PatentTitleYear
10,449,755Device for delaminating laminate, delamination method, and method for manufacturing electronic device2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019Patents assigned to AGC INC (1)· patent assignee history
2019Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
AGC INC12019
Locations
LocationPatentsSpan
Tokyo, JP12019