Inventor
Neal Callan
Inventor
Lake Oswego, OR, US
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices40%
G06FElectric digital data processing11%
G06NComputing arrangements based on specific computational models9%
H01LSemiconductor devices9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them7%
G02BOptical elements, systems or apparatus4%
G06TImage data processing or generation, in general4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
G06VImage or video recognition or understanding2%
PatentTitleYear
11,080,459Computational wafer inspection202110,579,772Computational wafer inspection20209,990,462Computational wafer inspection20189,507,907'Computational wafer inspection'20169,188,848'Maskless vortex phase shift optical direct write lithography'20158,377,633'Maskless vortex phase shift optical direct write lithography'20138,057,963'Maskless vortex phase shift optical direct write lithography'20118,015,540'Method and system for reducing inter-layer capacitance in integrated circuits'20117,738,078'Optimized mirror design for optical direct write'20107,499,146'Lithographic apparatus and device manufacturing method, an integrated circuit, a flat panel display, and a method of compensating for cupping'20097,396,760'Method and system for reducing inter-layer capacitance in integrated circuits'20087,376,260'Method for post-OPC multi layer overlay quality inspection'20087,372,547'Process and apparatus for achieving single exposure pattern transfer using maskless optical direct write lithography'20087,313,508'Process window compliant corrections of design layout'20077,270,942'Optimized mirror design for optical direct write'20077,189,498'Process and apparatus for generating a strong phase shift optical pattern for use in an optical direct write lithography process'20077,149,340'Mask defect analysis for both horizontal and vertical processing effects'20067,005,217'Chromeless phase shift mask'20066,864,020'Chromeless phase shift mask using non-linear optical materials'20056,782,525'Wafer process critical dimension, alignment, and registration analysis simulation tool'20046,775,818'Device parameter and gate performance simulation based on wafer image prediction'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2009Patents assigned to LSI LOGIC CORP (8)· patent assignee history
2004–2021Based in Lake Oswego, OR, US· patent location history
2007–2013Patents assigned to LSI CORP (8)· patent assignee history
2009–2021Patents assigned to ASML NETHERLANDS BV (5)· patent assignee history
2011–2013Patents assigned to CALLAN NEAL P (2)· patent assignee history
2011–2013Patents assigned to CROFFIE EBO H (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LSI CORP | 8 | 2007–2013 |
| LSI LOGIC CORP | 8 | 2004–2009 |
| ASML NETHERLANDS BV | 5 | 2009–2021 |
| CALLAN NEAL Pself | 2 | 2011–2013 |
| CROFFIE EBO H | 2 | 2011–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Lake Oswego, OR, US | 21 | 2004–2021 |