Inventor
Jae Man Park
Inventor
Seoul, KR
Overview
Patents· 44 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits19%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients9%
C08LCompositions of macromolecular compounds8%
Y10TTechnical subjects covered by former us classification8%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds7%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
H01GCapacitors4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
H01BCables4%
H01LSemiconductor devices3%
PatentTitleYear
10,635,421Electronic device, compiling method and computer-readable recording medium202010,593,957Gas diffusion layer for fuel cells and method of manufacturing the same202010,392,499Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the composition201910,280,289Epoxy resin composite and printed circuit board comprising insulating layer using the same20199,974,172Epoxy resin compound and radiant heat circuit board using the same20189,902,841'Inorganic filler, resin composition comprising the same and heat radiation substrate using the same'20189,844,142'Radiant heat circuit board and method for manufacturing the same'20179,670,340'Inorganic filler, resin composition comprising the same and heat radiation substrate using the same'20179,657,961'Interior lamp for vehicle having air vent'20179,549,458'Radiant heat circuit board, heat generating device package having the same, and backlight unit'20179,505,914'Inorganic filler, resin composition comprising the same and heat radiation substrate using the same'20169,468,096'Epoxy resin composition, and printed circuit board using same'20169,462,689'Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition'20169,451,695'Epoxy resin compound and radiant heat circuit board using the same'20169,445,500'Epoxy resin composition and printed circuit board using same'20169,357,630'Epoxy resin compound and radiant heat circuit board using the same'20169,307,675'Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight'20169,282,637'Epoxy resin compound and radiant heat circuit board using the same'20169,245,689'Multilayer ceramic electronic component and method of manufacturing the same'20169,202,629'Multilayer ceramic electronic component'20159,053,857'Nickel nanoparticle, method of preparing the same, and multilayer ceramic capacitor using the same'20159,040,840'Multilayer ceramic electronic component and mounting board therefor'20159,000,071'Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound'20158,964,354'Multi-layered ceramic electronic component and method of manufacturing the same'20158,941,973'Multilayer ceramic electronic component and method of manufacturing the same'20158,867,190'Multilayer ceramic electronic component having an average surface roughness to provide adhesion strength between a dielectric layer and inner electrode and fabrication method thereof'20147,107,730'PSSC complex girder'20066,318,038'Apparatus for retensing pre-stress structure'20015,507,872'Contact sensor-based microdispensing tool'19965,421,507'Au-Sn transient liquid bonding in high performance laminates'19955,340,451'Process for producing a metal organic polymer combination'19945,337,475'Process for producing ceramic circuit structures having conductive vias'19945,300,208'Fabrication of printed circuit boards using conducting polymer'19945,283,104'Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates'19945,280,414'Au-Sn transient liquid bonding in high performance laminates'19945,232,548'Discrete fabrication of multi-layer thin film, wiring structures'19935,055,342'Fluorinated polymeric composition, fabrication thereof and use thereof'19915,006,412'Substrate of metal-complexed beta-diketone/thermosetting polymer reaction product'19914,969,979'Direct electroplating of through holes'19904,869,930'Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization'19894,868,253'.beta.-diketone-polymer reaction product'19894,781,970'Strengthening a ceramic by post sinter coating with a compressive surface layer'19884,493,725'Fertilizer product with sustained action and process therefor'19854,428,987'Process for improving copper-epoxy adhesion'1984Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1985–2019Based in Seoul, KR· patent location history
1988–1996Patents assigned to IBM (14)· patent assignee history
1988–1989Based in Mahopac, NY, US· patent location history
1989–1994Based in Binghamton, NY, US· patent location history
1991–1995Based in Somers, NY, US· patent location history
2014–2018Patents assigned to PARK JAE MAN (9)· patent assignee history
2014–2016Patents assigned to SAMSUNG ELECTRO MECH (7)· patent assignee history
2014–2016Based in Kyungki-do, KR· patent location history
2015–2019Patents assigned to LG INNOTEK CO LTD (16)· patent assignee history
2016–2018Patents assigned to CHO IN HEE (6)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LG INNOTEK CO LTD | 16 | 2015–2019 |
| IBM | 14 | 1988–1996 |
| PARK JAE MANself | 9 | 2014–2018 |
| SAMSUNG ELECTRO MECH | 7 | 2014–2016 |
| CHO IN HEE | 6 | 2016–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seoul, KR | 18 | 1985–2019 |
| Kyungki-do, KR | 7 | 2014–2016 |
| Somers, New York, US | 7 | 1991–1995 |
| Binghamton, New York, US | 4 | 1989–1994 |
| Mahopac, New York, US | 2 | 1988–1989 |