Inventor
Kenichi Shirasaka
Inventor
Hamamatsu, JP
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
Y10TTechnical subjects covered by former us classification10%
G01CMeasuring distances, levels or bearings7%
G01RMeasuring electric variables7%
B81BMicrostructural devices or systems, e.g. micromechanical devices6%
H05KPrinted circuits6%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
A47JKitchen equipment1%
PatentTitleYear
8,138,757'Manufacturing method for magnetic sensor and lead frame therefor'20127,964,942'Lead frame having a die stage smaller than a semiconductor device and a semiconductor device using the same'20117,867,827'Physical quantity sensor, lead frame, and manufacturing method therefor'20117,829,982'Lead frame, sensor including lead frame and method of forming sensor including lead frame'20107,791,180'Physical quantity sensor and lead frame used for same'20107,754,130'Method for manufacturing physical quantity sensor'20107,727,793'Physical quantity sensor and manufacturing method therefor'20107,607,355'Semiconductor device'20097,595,548'Physical quantity sensor and manufacturing method therefor'20097,554,182'Semiconductor device and package, and method of manufacturer therefor'20097,541,294'Semiconductor package and semiconductor package mounting method'20097,541,665'Lead frame for a magnetic sensor'20097,524,696'Sensor including lead frame and method of forming sensor including lead frame'20097,494,838'Manufacturing method for magnetic sensor and lead frame therefor'20097,397,112'Semiconductor package and lead frame therefor'20087,319,042'Method and apparatus for manufacture and inspection of semiconductor device'20087,290,448'Physical quantity sensor, lead frame, and manufacturing method therefor'20077,195,953'Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein'20077,187,063'Manufacturing method for magnetic sensor and lead frame therefor'20077,170,149'Semiconductor device and package, and method of manufacture therefor'20076,979,910'Semiconductor package and semiconductor package mounting method'20056,861,282'Semiconductor package and semiconductor package mounting method'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2012Patents assigned to YAMAHA CORP (22)· patent assignee history
2005–2012Based in Hamamatsu, JP· patent location history
2007Based in Shizuoka, JP· patent location history
2012Patents assigned to ADACHI HIROSHI (1)· patent assignee history
2012Patents assigned to OMURA MASAYOSHI (1)· patent assignee history
2012Patents assigned to SAITOH HIROSHI (1)· patent assignee history
2012Patents assigned to SATO HIDEKI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| YAMAHA CORP | 22 | 2005–2012 |
| ADACHI HIROSHI | 1 | 2012 |
| OMURA MASAYOSHI | 1 | 2012 |
| SAITOH HIROSHI | 1 | 2012 |
| SATO HIDEKI | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hamamatsu, JP | 21 | 2005–2012 |
| Shizuoka, JP | 1 | 2007 |