Inventor
Inki Kim
Inventor
Tempe, AZ, US
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing21%
H10DInorganic electric semiconductor devices15%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
B82YSpecific uses or applications of nanostructures5%
G02BOptical elements, systems or apparatus5%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein5%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
A61KPreparations for medical, dental or toiletry purposes3%
PatentTitleYear
10,551,527Photonic diode and method of manufacturing the same202010,481,298Photonic diode and method of manufacturing the same201910,160,825Polyurethane elastomer, thermoplastic resin composition comprising the polyurethane elastomer, molded article made of the thermoplastic resin composition, and method of preparing the polyurethane elastomer20188,637,481'Sensitizing agents for cancer therapy, methods of use and methods for the identification thereof'20147,259,071'Semiconductor device with dual gate oxides'20077,241,665'Shallow trench isolation'20077,208,378'Semiconductor device having multiple gate oxide layers and method of manufacturing thereof'20077,091,104'Shallow trench isolation'20066,890,822'Semiconductor device having multiple gate oxide layers and method of manufacturing thereof'20056,818,514'Semiconductor device with dual gate oxides'20046,290,584'Workpiece carrier with segmented and floating retaining elements'20016,113,465'Method and apparatus for improving die planarity and global uniformity of semiconductor wafers in a chemical mechanical polishing context'20006,102,779'Method and apparatus for improved semiconductor wafer polishing'20006,089,961'Wafer polishing carrier and ring extension therefor'20005,993,293'Method and apparatus for improved semiconductor wafer polishing'19995,989,104'Workpiece carrier with monopiece pressure plate and low gimbal point'19995,921,849'Method and apparatus for distributing a polishing agent onto a polishing element'19995,695,392'Polishing device with improved handling of fluid polishing media'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–1999Patents assigned to SPEEDFAM CORP (3)· patent assignee history
1997–2001Based in Tempe, AZ, US· patent location history
1999–2001Patents assigned to SPEEDFAM IPEC CORP (4)· patent assignee history
2000Patents assigned to HEWLETT PACKARD CO (1)· patent assignee history
2004–2007Patents assigned to SILTERRA MALAYSIA SDN BHD (5)· patent assignee history
2004–2007Based in Seoul, KR· patent location history
2014Based in Pyongtaek, KR· patent location history
2018Based in Hwaseong-si, KR· patent location history
2019–2020Patents assigned to POSTECH ACAD IND FOUND (2)· patent assignee history
2019–2020Based in Gimpo-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SILTERRA MALAYSIA SDN BHD | 5 | 2004–2007 |
| SPEEDFAM IPEC CORP | 4 | 1999–2001 |
| SPEEDFAM CORP | 3 | 1997–1999 |
| POSTECH ACAD IND FOUND | 2 | 2019–2020 |
| HEWLETT PACKARD CO | 1 | 2000 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tempe, AZ, US | 8 | 1997–2001 |
| Seoul, KR | 6 | 2004–2007 |
| Gimpo-si, KR | 2 | 2019–2020 |
| Hwaseong-si, KR | 1 | 2018 |
| Pyongtaek, KR | 1 | 2014 |