Inventor
BRIAN J. BROWN
Inventor
US
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1032%
B24BMachines, devices, or processes for grinding or polishing30%
H01LSemiconductor devices23%
B08BCleaning in general7%
B65GTransport or storage devices, e.g. conveyors for loading or tipping, shop conveyor systems or pneumatic tube conveyors3%
G05BControl or regulating systems in general3%
G01DMeasuring not specially adapted for a specific variable1%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation1%
PatentTitleYear
12,576,475Determining the orientation of a substrate in-situ202612,434,347Method for CMP temperature control202512,400,881Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning202512,343,840Control of processing parameters for substrate polishing with substrate precession202512,296,427Apparatus and method for CMP temperature control202512,285,838Wafer edge asymmetry correction using groove in polishing pad202512,224,186Apparatus and method of brush cleaning using periodic chemical treatments202512,198,944Substrate handling in a modular polishing system with single substrate cleaning chambers202512,194,591Roller for location-specific wafer polishing202512,051,599Cleaning method with in-line SPM processing202412,030,156Polishing carrier head with piezoelectric pressure control202412,027,382Surface cleaning with directed high pressure chemistry202411,951,589Wafer edge asymmetry correction using groove in polishing pad202411,931,854Chemical mechanical polishing using time share control202411,931,853Control of processing parameters for substrate polishing with angularly distributed zones using cost function202411,897,079Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity202411,890,715Polishing carrier head with piezoelectric pressure control202411,826,872Temperature and slurry flow rate control in CMP202311,823,916Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning202311,764,069Asymmetry correction via variable relative velocity of a wafer202311,682,567Cleaning system with in-line SPM processing202311,400,560Retaining ring design202211,298,794Chemical mechanical polishing using time share control202211,267,095High throughput polishing system for workpieces2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to APPLIED MATERIALS INC (23)· patent assignee history
2022Patents assigned to UTICA LEASECO LLC (1)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 23 | 2022–2026 |
| UTICA LEASECO LLC | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 24 | 2022–2026 |