Inventor

Gregory M. Chrysler

Inventor

Chandler, AZ, US

Overview

1988–2016

Patent span

Electricity

Primary field (CPC H)

Patents· 97 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%

F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact6%

Y10TTechnical subjects covered by former us classification6%

F28FDetails of heat-exchange and heat-transfer apparatus, of general application5%

F25BRefrigeration machines, plants or systems5%

G06FElectric digital data processing4%

H05KPrinted circuits4%

H10NElectric solid-state devices not otherwise provided for4%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%

PatentTitleYear

9,406,582'Apparatus to minimize thermal impedance using copper on die backside'2016 8,686,277'Microelectronic assembly including built-in thermoelectric cooler and method of fabricating same'2014 8,623,705'Nanotube based vapor chamber for die level cooling'2014 8,518,750'Flexible interconnect pattern on semiconductor package'2013 8,505,613'Die having a via filled with a heat-dissipating material'2013 8,409,924'Flexible interconnect pattern on semiconductor package'2013 8,404,519'Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patterns'2013 8,333,569'Method and apparatus for two-phase start-up operation'2012 8,313,282'Compact air-plus-liquid thermal management module'2012 8,227,907'Flexible interconnect pattern on semiconductor package'2012 8,209,989'Microarchitecture control for thermoelectric cooling'2012 8,164,169'Cooling devices in semiconductor packages'2012 8,125,075'Carbon nanotube micro-chimney and thermo siphon die-level cooling'2012 8,006,747'Micro-chimney and thermosiphon die-level cooling'2011 7,964,447'Process of making carbon nanotube array that includes impregnating the carbon nanotube array with metal'2011 7,915,081'Flexible interconnect pattern on semiconductor package'2011 7,911,052'Nanotube based vapor chamber for die level cooling'2011 7,851,905'Microelectronic package and method of cooling an interconnect feature in same'2010 7,825,503'Covered devices in a semiconductor package'2010 7,795,711'Microelectronic cooling apparatus and associated method'2010 7,779,638'Localized microelectronic cooling apparatuses and associated methods and systems'2010 7,713,839'Diamond substrate formation for electronic assemblies'2010 7,633,753'Piezoelectric air jet augmented cooling for electronic devices'2009 7,622,327'Covered devices in a semiconductor package'2009 7,589,417'Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same'2009 7,557,438'Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same'2009 7,550,901'Piezoelectric fan, cooling device containing same, and method of cooling a microelectronic device using same'2009 7,545,030'Article having metal impregnated within carbon nanotube array'2009 7,537,954'Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same'2009 7,538,476'Multi-layer piezoelectric actuators with conductive polymer electrodes'2009 7,508,671'Computer system having controlled cooling'2009 7,499,278'Method and apparatus for dissipating heat from an electronic device'2009 7,487,822'Micro-chimney and thermosiphon die-level cooling'2009 7,471,515'Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment'2008 7,457,116'Method and system to cool memory'2008 7,449,780'Apparatus to minimize thermal impedance using copper on die backside'2008 7,435,623'Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon'2008 7,430,870'Localized microelectronic cooling'2008 7,432,532'Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat'2008 7,397,119'Wafer-level diamond spreader'2008 7,367,195'Application and removal of thermal interface material'2008 7,362,580'Electronic assembly having an indium wetting layer on a thermally conductive body'2008 7,348,665'Liquid metal thermal interface for an integrated circuit device'2008 7,335,983'Carbon nanotube micro-chimney and thermo siphon die-level cooling'2008 7,336,487'Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant'2008 7,317,615'Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment'2008 7,279,796'Microelectronic die having a thermoelectric module'2007 7,259,965'Integrated circuit coolant microchannel assembly with targeted channel configuration'2007 7,243,705'Integrated circuit coolant microchannel with compliant cover'2007 7,218,519'Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels'2007 7,211,890'Integrating thermoelectric elements into wafer for heat extraction'2007 7,170,098'Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat'2007 7,098,079'Electronic assembly with high capacity thermal interface and methods of manufacture'2006 7,082,031'Heatsink device and method'2006 7,071,552'IC die with directly bonded liquid cooling device'2006 7,063,268'Electro-active fluid cooling system'2006 7,034,394'Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same'2006 7,031,155'Electronic thermal management'2006 7,021,891'Micro-impeller miniature centrifugal compressor'2006 7,012,011'Wafer-level diamond spreader'2006 6,992,382'Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon'2006 6,988,531'Micro-chimney and thermosiphon die-level cooling'2006 6,981,380'Thermoelectric cooling for microelectronic packages and dice'2006 6,971,442'Method and apparatus for dissipating heat from an electronic device'2005 6,967,840'Clearing of vapor lock in a microchannel cooling subsystem'2005 6,936,497'Method of forming electronic dies wherein each die has a layer of solid diamond'2005 6,921,706'Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat'2005 6,862,183'Composite fins for heat sinks'2005 6,845,622'Phase-change refrigeration apparatus with thermoelectric cooling element and methods'2005 6,795,311'Method and apparatus for cooling portable computers'2004 6,785,134'Embedded liquid pump and microchannel cooling system'2004 6,770,966'Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat'2004 6,706,562'Electronic assembly with high capacity thermal spreader and methods of manufacture'2004 6,661,660'Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment'2003 6,653,730'Electronic assembly with high capacity thermal interface'2003 6,650,542'Piezoelectric actuated jet impingement cooling'2003 6,646,874'Mobile computer system with detachable thermoelectric module for enhanced cooling capability in a docking station'2003 6,639,799'Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment'2003 6,636,423'Composite fins for heat sinks'2003 6,609,561'Tunnel-phase change heat exchanger'2003 6,561,267'Heat sink and electronic circuit module including the same'2003 6,549,407'Heat exchanger retention mechanism'2003 6,223,813'Ultra high-density, high-performance heat sink'2001 6,223,810'Extended air cooling with heat loop for dense or compact configurations of electronic components'2001 6,213,194'Hybrid cooling system for electronics module'2001 6,023,410'Extended cooling for portable computers'2000 5,953,930'Evaporator for use in an extended air cooling system for electronic components'1999 5,926,368'Enhanced air cooling system with attached cooling unit'1999 5,825,620'Enhanced air cooling system with attached cooling unit'1998 5,758,418'Method of making an ultra high-density, high-performance heat sink'1998 5,761,037'Orientation independent evaporator'1998 5,743,794'Method for field upgrading of air cooling capacity'1998 5,719,745'Extended surface cooling for chip stack applications'1998 5,704,419'Air flow distribution in integrated circuit spot coolers'1998 5,604,665'Multiple parallel impingement flow cooling with tuning'1997 5,303,555'Electronics package with improved thermal management by thermoacoustic heat pumping'1994 4,765,397'Immersion cooled circuit module with improved fins'1988

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1988–2001Patents assigned to IBM (15)· patent assignee history

1988–2001Based in Poughkeepsie, NY, US· patent location history

1999–2016Based in Chandler, AZ, US· patent location history

2003–2016Patents assigned to INTEL CORP (81)· patent assignee history

2011–2014Based in Sun Lakes, AZ, US· patent location history

2012–2016Patents assigned to CHRYSLER GREGORY M (10)· patent assignee history

2012–2016Patents assigned to MAVEETY JAMES G (5)· patent assignee history

2012–2013Patents assigned to CHAU DAVID (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
INTEL CORP	81	2003–2016
IBM	15	1988–2001
CHRYSLER GREGORY Mself	10	2012–2016
MAVEETY JAMES G	5	2012–2016
CHAU DAVID	3	2012–2013

Locations

Location	Patents	Span
Chandler, AZ, US	83	1999–2016
Poughkeepsie, New York, US	11	1988–2001
Sun Lakes, AZ, US	3	2011–2014