Inventor

Chee Hiong Chew

Inventor

Seremban, MY

Overview

1999–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 39 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%

H01LSemiconductor devices28%

H01RElectrically-conductive connections12%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%

H10DInorganic electric semiconductor devices3%

H05KPrinted circuits2%

LOC132%

Y10TTechnical subjects covered by former us classification2%

G06FElectric digital data processing1%

H01FMagnets1%

PatentTitleYear

10,861,775Connecting clip design for pressure sintering2020 10,861,767Package structure with multiple substrates2020 10,825,786Polymer resin and compression mold chip scale package2020 10,825,748Semiconductor package system and related methods2020 10,756,006Leadless semiconductor packages, leadframes therefor, and methods of making2020 10,727,170Semiconductor devices and methods of making the same2020 10,720,725Flexible press fit pins for semiconductor packages and related methods2020 10,700,018Reinforced semiconductor die and related methods2020 10,693,270Press-fit pin for semiconductor packages and related methods2020 10,607,903Semiconductor package with elastic coupler and related methods2020 10,559,510Molded wafer level packaging2020 10,559,905Flexible press fit pins for semiconductor packages and related methods2020 10,319,652Semiconductor package with elastic coupler and related methods2019 10,283,466Polymer resin and compression mold chip scale package2019 10,231,340Single reflow power pin connections2019 10,224,655Flexible press fit pins for semiconductor packages and related methods2019 10,199,311Leadless semiconductor packages, leadframes therefor, and methods of making2019 10,121,763Clip and related methods2018 9,967,986Semiconductor package and method therefor2018 9,941,257Embedded stacked die packages and related methods2018 9,911,712'Clip and related methods'2018 9,748,163'Die support for enlarging die size'2017 9,691,732'Semiconductor package with elastic coupler and related methods'2017 9,679,878'Embedded stacked die packages and related methods'2017 9,620,877'Flexible press fit pins for semiconductor packages and related methods'2017 9,570,832'Press-fit pin for semiconductor packages and related methods'2017 9,431,311'Semiconductor package with elastic coupler and related methods'2016 D0755742'Power device package'2016 D0755741'Power device package'2016 8,519,521'Electronic device including a packaging substrate having a trench'2013 8,268,676'Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leads'2012 7,736,951'Circuit component and method of manufacture'2010 6,910,210'System and method for terminating applications'2005 6,475,834'Method of manufacturing a semiconductor component and semiconductor component thereof'2002 6,472,731'Solder clad lead frame for assembly of semiconductor devices and method'2002 6,392,288'Lead frame for assembly for thin small outline plastic encapsulated packages'2002 6,376,266'Semiconductor package and method for forming same'2002 5,973,388'Leadframe, method of manufacturing a leadframe, and method of packaging an electronic component utilizing the leadframe'1999 5,920,113'Leadframe structure having moveable sub-frame'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2020Based in Seremban, MY· patent location history

1999–2002Based in Negeri Sembilan, MY· patent location history

2002–2020Patents assigned to SEMICONDUCTOR COMPONENTS IND (10)· patent assignee history

2005Based in Redmond, WA, US· patent location history

2012–2013Patents assigned to CHEW CHEE HIONG (2)· patent assignee history

2012–2013Patents assigned to KRISHNAN SHUTESH (2)· patent assignee history

2012–2013Patents assigned to KUMAR JATINDER (2)· patent assignee history

2016–2020Patents assigned to SEMICONDUCTOR COMPONENTS IND LLC (26)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SEMICONDUCTOR COMPONENTS IND LLC	26	2016–2020
SEMICONDUCTOR COMPONENTS IND	10	2002–2020
CHEW CHEE HIONGself	2	2012–2013
KRISHNAN SHUTESH	2	2012–2013
KUMAR JATINDER	2	2012–2013

Locations

Location	Patents	Span
Seremban, MY	33	1999–2020
Negeri Sembilan, MY	5	1999–2002
Redmond, Washington, US	1	2005