Inventor
CHI-JEN LIU
Inventor
TW
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
C09GPolishing compositions15%
H10DInorganic electric semiconductor devices9%
B24BMachines, devices, or processes for grinding or polishing6%
C09KMaterials for miscellaneous applications, not provided for elsewhere4%
C11DDetergent compositions3%
H05BElectric heating1%
PatentTitleYear
12,550,695Methods of forming an abrasive slurry and methods for chemical-mechanical polishing202612,486,479Semiconductor device cleaning solution, method of use, and method of manufacture202512,359,090Composition and method for polishing and integrated circuit202512,347,735In-situ defect count detection in post chemical mechanical polishing202512,297,375Slurry composition and method for polishing and integrated circuit202512,224,179Metal heterojunction structure with capping metal layer202512,131,944Slurry composition, semiconductor structure and method for forming the same202412,002,684Methods for chemical mechanical polishing and forming interconnect structure202411,996,283Method for metal gate surface clean202411,773,353Semiconductor device cleaning solution, method of use, and method of manufacture202311,658,065Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure202311,637,021Metal heterojunction structure with capping metal layer202311,633,829External heating system for use in chemical mechanical polishing system202311,508,585Methods for chemical mechanical polishing and forming interconnect structure202211,482,450Methods of forming an abrasive slurry and methods for chemical- mechanical polishing202211,410,846Method for metal gate surface clean2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (16)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 16 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 16 | 2022–2026 |