Inventor

Jeff Tsai

Inventor

Chu-Nan, TW

Overview

4→

Patents

1999–2019

Patent span

Performing operations

Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary

B24BMachines, devices, or processes for grinding or polishing21%

G01NInvestigating or analysing materials by determining their chemical or physical properties14%

B24DTools for grinding, buffing or sharpening7%

B26DCutting7%

B29CShaping or joining of plastics7%

B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts7%

B29LIndexing scheme associated with subclass b29c, relating to particular articles7%

C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds7%

H01LSemiconductor devices7%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%

PatentTitleYear

10,272,541Polishing layer analyzer and method2019 9,770,808'Method of manufacturing chemical mechanical polishing pads'2017 9,737,971'Chemical mechanical polishing pad, polishing layer analyzer and method'2017 5,886,113'Process for preparing an elastomeric copolymer composition of mono-vinyl aromatic hydrocarbons and conjugated dienes'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999Patents assigned to TAIWAN SYNTHETIC RUBBER CORP (1)· patent assignee history

1999Based in Hsin Chu Hsien, TW· patent location history

2017–2019Patents assigned to DOW GLOBAL TECHNOLOGIES LLC (3)· patent assignee history

2017–2019Patents assigned to ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC (3)· patent assignee history

2017–2019Based in Chu-Nan, TW· patent location history

2019Patents assigned to ROHM AND HAAS ELECTRONIC MATERICALS CMP HOLDINGS INC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
DOW GLOBAL TECHNOLOGIES LLC	3	2017–2019
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC	3	2017–2019
ROHM AND HAAS ELECTRONIC MATERICALS CMP HOLDINGS INC	1	2019
TAIWAN SYNTHETIC RUBBER CORP	1	1999

Locations

Location	Patents	Span
Chu-Nan, TW	3	2017–2019
Hsin Chu Hsien, TW	1	1999