LexDanaLexDanabeta
Inventor

Hideaki Ishizawa

Inventor
Osaka, JP

Overview

13→
Patents
2003–2018
Patent span
Chemistry
Primary field (CPC C)

Patents· 13 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C09Jprimary
C09JAdhesives14%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
C08LCompositions of macromolecular compounds8%
H01BCables8%
H05KPrinted circuits8%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients6%
B22FWorking metallic powder4%
H01LSemiconductor devices4%
H01RElectrically-conductive connections4%
PatentTitleYear
9,928,934'Curable composition for electronic component and connection structure'20189,490,046'Conductive material and connected structure'20169,446,484'Conductive particles, method for producing conductive particles, conductive material and connection structure'20168,901,207'Adhesive for electronic components'20148,802,989'Conductive material and connection structure'20148,563,362'Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particles'20138,119,323'Process for producing patterned film and photosensitive resin composition'20127,915,743'Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device'20117,838,577'Adhesive for electronic component'20107,262,231'Photosensitive amine generator, photocurable composition and photoreactive adhesive composition'20077,012,123'Acrylic polymer and charge transport material'20066,864,300'Photoreactive adhesive composition and method of bonding with the same'20056,641,912'Photocurable pressure-sensitive adhesive composition and its sheet'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2018Patents assigned to SEKISUI CHEMICAL CO LTD (12)· patent assignee history
2003–2018Based in Osaka, JP· patent location history
2007Based in Hirakata, JP· patent location history
2012–2014Patents assigned to ISHIZAWA HIDEAKI (3)· patent assignee history
2013–2014Patents assigned to HAYAKAWA AKINOBU (2)· patent assignee history
2013–2014Patents assigned to MASUI RYOHEI (2)· patent assignee history
2013–2014Patents assigned to TAKEDA KOHEI (2)· patent assignee history
2016Based in Kouka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SEKISUI CHEMICAL CO LTD122003–2018
ISHIZAWA HIDEAKIself32012–2014
HAYAKAWA AKINOBU22013–2014
MASUI RYOHEI22013–2014
TAKEDA KOHEI22013–2014
Locations
LocationPatentsSpan
Osaka, JP112003–2018
Kouka, JP12016
Hirakata, JP12007