Inventor

CHUN-HENG CHEN

Inventor
TW

Overview

21→
Patents
2022–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 21 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary
H10DInorganic electric semiconductor devices35%
H01LSemiconductor devices27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
B82YSpecific uses or applications of nanostructures7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
PatentTitleYear
12,563,797Semiconductor device structure and method for forming the same202612,501,697Methods of forming semiconductor devices202512,376,344Semiconductor device comprising channel layers with different thicknesses202512,336,248Non-conformal gate oxide formation on FinFET202512,336,211Dielectric layer on semiconductor device and method of forming the same202512,310,074NanoStructure field-effect transistor device and methods of forming202512,278,267Semiconductor devices having funnel-shaped gate structures202512,218,197Gate oxide of nanostructure transistor with increased corner thickness202512,199,158Non-conformal oxide liner and manufacturing methods thereof202512,046,660Non-conformal capping layer and method forming same202412,015,031Semiconductor device and method202411,990,509Semiconductor devices having gate structures with slanted sidewalls202411,942,556Semiconductor device and manufacturing method thereof202411,855,140Gate oxide of nanostructure transistor with increased corner thickness202311,855,095Semiconductor device202311,640,977Non-conformal oxide liner and manufacturing methods thereof202311,532,718FinFET having a gate dielectric comprising a multi-layer structure including an oxide layer with different thicknesses on side and top surfaces of the fins202211,469,229Semiconductor device and method202211,437,491Non-conformal capping layer and method forming same202211,430,865Semiconductor device and method202211,296,084Deposition method, semiconductor device and method of fabricating the same2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (21)· patent assignee history
2022–2026Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD212022–2026
Locations
LocationPatentsSpan
TW212022–2026