Inventor
Mikio Nishihara
Inventor
Kawasaki, JP
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits47%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
Y10TTechnical subjects covered by former us classification21%
H01RElectrically-conductive connections11%
PatentTitleYear
6,485,814'High density thin film circuit board and method of production thereof'20025,496,971'Circuit arrangement for multilayer printed circuit board'19965,475,922'Method of assembling a connector using frangible contact parts'19955,354,209'Connector and method of assembling the same'19945,181,317'Method of making an engineering change to a printed wiring board'19934,785,141'Wiring structure of termination circuit'19884,692,843'Multilayer printed wiring board'19874,675,789'High density multilayer printed circuit board'19874,298,770'Printed board'19814,159,508'Multilayer printed wiring board'19794,150,421'Multi-layer printed circuit board'1979Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1979–2002Patents assigned to FUJITSU LTD (11)· patent assignee history
1979–1981Based in Yokohama, JP· patent location history
1987–1993Based in Tokyo, JP· patent location history
1988Based in Setagaya, JP· patent location history
1994–2002Based in Kawasaki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 11 | 1979–2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 4 | 1994–2002 |
| Tokyo, JP | 3 | 1987–1993 |
| Yokohama, JP | 3 | 1979–1981 |
| Setagaya, JP | 1 | 1988 |