Inventor

CHING-HUA HSIEH

Inventor

TW

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 110 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices31%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%

B29CShaping or joining of plastics3%

H10DInorganic electric semiconductor devices3%

B23KSoldering or unsoldering2%

G02BOptical elements, systems or apparatus2%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form1%

H01QAntennas, i.e. radio aerials1%

H05KPrinted circuits1%

PatentTitleYear

12,599,018Package structure with enhancement structure and manufacturing method thereof2026 12,593,732Semiconductor device and manufacturing method thereof2026 12,581,977Bonding through multi-shot laser reflow2026 12,568,854Semiconductor packages having semiconductor blocks surrounding semiconductor device2026 12,564,054Package structure2026 12,564,008Method and treatment system for uniform processing of semiconductor devices2026 12,564,055Package structure and method of fabricating the same2026 12,543,612Semiconductor devices and methods of forming the same2026 12,538,827Semiconductor structure2026 12,512,451Semiconductor package and manufacturing method of the same2025 12,512,384Semiconductor package with electrically conductive structure and manufacturing method thereof2025 12,512,419Method of fabricating memory device and package structure2025 12,500,219Trimming and sawing processes in the formation of wafer-form packages2025 12,500,113Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor package2025 12,489,030Methods of manufacturing integrated fan-out packages with embedded heat dissipation structure2025 12,485,664Lamination apparatus and method2025 12,469,818Method and apparatus for bonding semiconductor substrate2025 12,463,175Bonding with pre-deoxide process and apparatus for performing the same2025 12,463,067Pickup apparatus and method of using the same2025 12,441,097Lamination process, and manufacturing method of semiconductor package using a chuck2025 12,444,719Package and manufacturing method thereof2025 12,438,007Staggered metal mesh on backside of device die and method forming same2025 12,431,446Package structure2025 12,417,927Semiconductor device and method of manufacture2025 12,406,961Integrated circuit package and method2025 12,391,033Lamination process, and manufacturing method of semiconductor package using a chuck2025 12,388,060Integrated fan-out packages and methods of forming the same2025 12,374,595Package system and manufacturing method thereof2025 12,368,053Method for laser drilling process for an integrated circuit package2025 12,368,149Methods of forming semiconductor packages2025 12,368,086Package structure having thermoelectric cooler2025 12,358,194Molded semiconductor device and manufacturing method of molded semiconductor device2025 12,354,997Package structure and manufacturing method thereof2025 12,354,929Package structure and manufacturing method thereof2025 12,334,424Package structure and manufacturing method thereof2025 12,322,640Semiconductor package and manufacturing method thereof2025 12,300,684Semiconductor packages2025 12,300,659Aligning bumps in fan-out packaging process2025 12,266,673Semiconductor package and method of forming the same2025 12,266,559Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece2025 12,261,088Package structure and method of forming the same2025 12,230,549Three-dimensional integrated circuit structures and methods of forming the same2025 12,230,597Package structure with warpage-control element2025 12,218,082Package structure2025 12,176,299Semiconductor device and manufacturing method thereof2024 12,176,319Reflow method and system2024 12,176,279Package structure and manufacturing method thereof2024 12,125,797Package structure with fan-out feature2024 12,107,064Semiconductor package and manufacturing method thereof2024 12,080,653Formation method of chip package with fan-out structure2024 12,062,832Electronic device and manufacturing method thereof2024 12,057,359Semiconductor package and method of fabricating the same2024 12,057,415Semiconductor device having antenna and manufacturing method thereof2024 12,051,655Package structure and method of forming the same2024 12,051,639Package structure and manufacturing method thereof2024 12,040,255Semiconductor package and manufacturing method thereof2024 12,040,309Bonding through multi-shot laser reflow2024 12,040,247Package system and manufacturing method thereof2024 12,033,992Package and manufacturing method thereof2024 12,021,037Method for manufacturing package structure2024 12,011,859Molding apparatus and manufacturing method of molded semiconductor device2024 12,009,322Package structure with through-via in molding compound and dielectric layer2024 11,996,400Manufacturing method of package on package structure2024 11,993,066Chuck, lamination process, and manufacturing method of semiconductor package using the same2024 11,955,460Advanced info POP and method of forming thereof2024 11,942,464Semiconductor package and method2024 11,942,451Semiconductor structure and method of forming the same2024 11,901,258Iintegrated fan-out packages with embedded heat dissipation structure2024 11,878,388Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same2024 11,874,513Package structure2024 11,862,577Package structure and method of fabricating the same2024 11,855,006Memory device, package structure and fabricating method thereof2023 11,830,746Semiconductor device and method of manufacture2023 11,830,781Package structure and manufacturing method thereof2023 11,791,192Workpiece holder, wafer chuck, wafer holding method2023 11,776,838Semiconductor package and manufacturing method thereof2023 11,764,127Semiconductor package and manufacturing method thereof2023 11,756,872Package structure and manufacturing method thereof2023 11,731,327Molding apparatus and manufacturing method of molded semiconductor device2023 11,721,659Package structure with warpage-control element2023 11,705,409Semiconductor device having antenna on chip package and manufacturing method thereof2023 11,688,725Semiconductor packages2023 11,664,300Fan-out packages and methods of forming the same2023 11,646,293Semiconductor structure and method2023 11,640,954Semiconductor package structure2023 11,631,652Method and apparatus for bonding semiconductor substrate2023 11,610,859Reflow method and system2023 11,585,992Package structure2023 11,587,887Semiconductor device and manufacturing method thereof2023 11,569,183Package structure and method of fabricating the same2023 11,532,564Package structure2022 11,532,551Semiconductor package with chamfered semiconductor device2022 11,482,491Package structure with porous conductive structure and manufacturing method thereof2022 11,462,507Bonding through multi-shot laser reflow2022 11,456,226Semiconductor package and method of fabricating the same2022 11,446,851Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device2022 11,417,698Semiconductor package and method of forming the same2022 11,404,381Chip package with fan-out structure2022 11,342,302Bonding with pre-deoxide process and apparatus for performing the same2022 11,342,321Manufacturing method of package on package structure2022 11,309,226Three-dimensional integrated circuit structures and methods of forming the same2022 11,309,294Integrated fan-out packages and methods of forming the same2022 11,282,810Integrated fan-out package and manufacturing method thereof2022 11,251,141Package structure2022 11,251,131Copper contact plugs with barrier layers2022 11,233,039Semiconductor packages2022 11,217,555Aligning bumps in fan-out packaging process2022 11,211,341Package structure and method of fabrcating the same2021 11,177,237Manufacturing method of semiconductor package2021 11,177,156Semiconductor package, manufacturing method of semiconductor device and semiconductor package2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (109)· patent assignee history

2021–2026Based in TW· patent location history

2026Patents assigned to TAIWAN SEMICONDUCTOR MFG COMPANY LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	109	2021–2026
TAIWAN SEMICONDUCTOR MFG COMPANY LTD	1	2026

Locations

Location	Patents	Span
TW	110	2021–2026