Inventor
Shoriki Narita
Inventor
Hirakata, JP
Overview
Patents· 28 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1028%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
Y10TTechnical subjects covered by former us classification17%
H05KPrinted circuits13%
B23KSoldering or unsoldering4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
B25JManipulators3%
G01RMeasuring electric variables3%
G06TImage data processing or generation, in general1%
PatentTitleYear
7,806,642'Receiver for component feed plates and component feeder'20107,797,820'Component mounting apparatus'20107,731,469'Component feeder'20107,650,691'Component supply head device and component mounting head device'20107,552,528'Wafer expanding device, component feeder, and expanding method for wafer sheet'20097,516,878'Bump formation method and bump forming apparatus for semiconductor wafer'20097,452,315'Tool exchange device and tool'20087,387,229'Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore'20087,353,596'Component mounting method'20087,350,684'Apparatus and method for forming bump'20087,350,289'Component feeding head apparatus, for holding a component arrayed'20087,306,551'Tool exchange device and tool'20077,052,984'Bump formation method and bump forming apparatus for semiconductor wafer'20067,031,509'Method and apparatus for correcting inclination of IC on semiconductor wafer'20067,014,092'Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate'20067,005,368'BUMP FORMING APPARATUS FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVAL METHOD FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVING UNIT FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, AND CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE'20066,910,613'Device and method for forming bump'20056,818,975'ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEVICE, METHOD OF REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE DEVICE FOR REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE, AND ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE'20046,787,391'Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor'20046,568,580'Bump bonding apparatus and method'20036,494,358'Bump bonding apparatus and method'20026,392,202'Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer'20026,329,640'Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer'20016,302,317'Bump bonding apparatus and method'20016,098,868'Bump forming method and bump bonder'20005,955,876'Board positioning apparatus'19995,769,236'Component collective and component collective feeding apparatus'19985,648,729'Board positioning method and apparatus of the methods'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2008Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (21)· patent assignee history
1997–1999Based in Kadoma, JP· patent location history
2000–2010Based in Hirakata, JP· patent location history
2001–2010Based in Osaka, JP· patent location history
2008–2010Patents assigned to PANASONIC CORP (7)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 21 | 1997–2008 |
| PANASONIC CORP | 7 | 2008–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hirakata, JP | 20 | 2000–2010 |
| Osaka, JP | 5 | 2001–2010 |
| Kadoma, JP | 3 | 1997–1999 |