Inventor
THAI KEE GAN
Inventor
MY
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices42%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H05KPrinted circuits5%
H10DInorganic electric semiconductor devices5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
PatentTitleYear
12,205,874Semiconductor package with wire bond joints202512,068,213Chip package and semiconductor arrangement having thermally conductive material in contact with a semiconductor chip and methods of forming thereof202412,057,376Three level interconnect clip202411,984,392Semiconductor package having a chip carrier with a pad offset feature202411,842,953Semiconductor package with wire bond joints and related methods of manufacturing202311,652,078High voltage semiconductor package with pin fit leads202311,417,538Semiconductor package including leads of different lengths202211,348,866Package and lead frame design for enhanced creepage and clearance2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INFINEON TECHNOLOGIES AG (7)· patent assignee history
2022Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (1)· patent assignee history
2022–2025Based in MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 7 | 2022–2025 |
| INFINEON TECHNOLOGIES AUSTRIA AG | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| MY | 8 | 2022–2025 |