Inventor
SUSHUMNA IRUVANTI
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H05KPrinted circuits16%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application5%
G06FElectric digital data processing5%
PatentTitleYear
11,882,645Multi chip hardware security module202411,569,181Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers202311,302,651Laminated stiffener to control the warpage of electronic chip carriers202211,264,306Hybrid TIMs for electronic package cooling202211,158,562Conformal integrated circuit (IC) device package lid202111,152,282Localized catalyst for enhanced thermal interface material heat transfer2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to IBM (6)· patent assignee history
2021–2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 6 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2021–2024 |