Inventor
JoongGi Kim
Inventor
Pusan, KR
Overview
Patents· 2 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
9,679,846'Semiconductor device and method of forming conductive layer over substrate with vents to channel bump material and reduce interconnect voids'20178,952,529'Semiconductor device with conductive layer over substrate with vents to channel bump material and reduce interconnect voids'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015–2017Patents assigned to STATS CHIPPAC LTD (2)· patent assignee history
2015Patents assigned to KIM JOONGGI (1)· patent assignee history
2015Patents assigned to KIM SUNJAE (1)· patent assignee history
2015Patents assigned to LEE JAEHYUN (1)· patent assignee history
2015–2017Based in Pusan, KR· patent location history
2017Patents assigned to STATS CHIPPAC PTE LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| STATS CHIPPAC LTD | 2 | 2015–2017 |
| KIM JOONGGIself | 1 | 2015 |
| KIM SUNJAE | 1 | 2015 |
| LEE JAEHYUN | 1 | 2015 |
| STATS CHIPPAC PTE LTD | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Pusan, KR | 2 | 2015–2017 |