Inventor
WEI-SHENG LEI
Inventor
US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
B23KSoldering or unsoldering17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H05KPrinted circuits5%
H10DInorganic electric semiconductor devices4%
B29CShaping or joining of plastics3%
H01JElectric discharge tubes or discharge lamps3%
A47GHousehold or table equipment1%
B22FWorking metallic powder1%
PatentTitleYear
12,518,986Laser ablation system for package fabrication202612,388,049High connectivity device stacking202512,374,678Lithium metal surface modification using carbonate passivation202512,358,073Method and apparatus for laser drilling blind vias202512,131,952Wafer dicing using femtosecond-based laser and plasma etch202412,091,349Laser dicing glass wafers using advanced laser sources202411,964,343Laser dicing system for filamenting and singulating optical devices202411,854,888Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach202311,742,330High connectivity device stacking202311,705,365Methods of micro-via formation for advanced packaging202311,676,832Laser ablation system for package fabrication202311,621,194Wafer dicing using femtosecond-based laser and plasma etch202311,518,100Additive manufacturing with a polygon scanner202211,400,545Laser ablation for package fabrication202211,355,394Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate breakthrough treatment202211,257,790High connectivity device stacking202211,232,951Method and apparatus for laser drilling blind vias202211,217,536Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process202211,158,540Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to APPLIED MATERIALS INC (18)· patent assignee history
2021–2026Based in US· patent location history
2025Patents assigned to ELEVATED MAT US LLC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 18 | 2021–2026 |
| ELEVATED MAT US LLC | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 19 | 2021–2026 |