Inventor
LIANG DING
Inventor
CN
Overview
Patents· 43 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G02Bprimary
G02BOptical elements, systems or apparatus17%
H04NPictorial communication, e.g. television13%
H01LSemiconductor devices11%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them8%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
G06FElectric digital data processing4%
H05KPrinted circuits3%
B25JManipulators3%
B62DMotor vehicles3%
PatentTitleYear
12,527,095Method of fabricating Si photonics chip with integrated high speed Ge photo detector working for entire C- and L-band202612,509,015Steering wheel and method for turning on preset function in vehicle by using steering wheel202512,443,649Multimedia file playing method and apparatus for rotatable device202512,370,676Robot state planning method based on Monte Carlo tree search algorithm202512,371,857Method and apparatus for anomaly detection on a doctor blade of a papermaking machine, and computing device202512,298,533Manufacturing method of a molded photosensitive assembly for an array imaging module202512,274,036Heatsink for co-packaged optical switch rack package202512,234,040Multi-purpose planet rover202512,231,759Split lens and camera module and electronic apparatus202512,189,202Split lens assembly and camera module202512,105,350Adjustable optical lens and camera module and manufacturing method and applications thereof202412,079,005Three-layer intelligence system architecture and an exploration robot202412,057,403Light engine based on silicon photonics TSV interposer202412,030,430Steering wheel202411,877,044Integral packaging process-based camera module, integral base component of same, and manufacturing method thereof202411,874,584Lens module and capturing module integrating focusing mechanism and assembly method therefor202411,874,518Camera lens module and manufacturing method thereof202411,867,965Adjustable optical lens and camera module and manufacturing method thereof202411,835,784Adjustable optical lens and camera module and aligning method thereof202311,822,099Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device202311,777,631In-packaged multi-channel light engine on single substrate202311,743,569Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof202311,706,516Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof202311,703,654Camera lens module and manufacturing method thereof202311,677,478Method for co-packaging light engine chiplets on switch substrate202311,664,319Light engine based on silicon photonics TSV interposer202311,662,543Multi-group lens, camera module, and electronic device thereof202311,659,263Split lens and camera module and electronic apparatus202311,612,079Heatsink for co-packaged optical switch rack package202311,570,336System-level camera module with electrical support and manufacturing method thereof202311,531,180Multi-group lens, camera module, and electronic device thereof202211,435,545Camera lens module and manufacturing method thereof202211,385,432Camera lens module and manufacturing method thereof202211,377,162Soft biomimetic legged robot202211,367,687Light engine based on silicon photonics TSV interposer202211,360,832Operation method of robot operating system and a robot control method202211,303,789Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof202211,216,319Intelligent real-time robot operating system architecture and operation method thereof202211,218,242In-packaged multi-channel light engine on single substrate202211,195,329Terrain modeling method that fuses geometric characteristics and mechanical characteristics and computer readable storage medium thereof202111,178,473Co-packaged light engine chiplets on switch substrate202111,163,216Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device202111,165,509Method for co-packaging light engine chiplets on switch substrate2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to NINGBO SUNNY OPOTECH CO LTD (21)· patent assignee history
2021–2026Patents assigned to MARVELL ASIA PTE LTD (11)· patent assignee history
2021–2025Patents assigned to HARBIN INST TECHNOLOGY (5)· patent assignee history
2021–2022Patents assigned to INPHI CORP (3)· patent assignee history
2021–2025Based in CN· patent location history
2021–2025Based in SG· patent location history
2022–2024Based in US· patent location history
2024–2025Patents assigned to AUTOLIV DEV (2)· patent assignee history
2026Based in CA· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NINGBO SUNNY OPOTECH CO LTD | 21 | 2021–2025 |
| MARVELL ASIA PTE LTD | 11 | 2021–2026 |
| HARBIN INST TECHNOLOGY | 5 | 2021–2025 |
| INPHI CORP | 3 | 2021–2022 |
| AUTOLIV DEV | 2 | 2024–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 32 | 2021–2025 |
| SG | 7 | 2021–2025 |
| US | 3 | 2022–2024 |
| CA | 1 | 2026 |