Inventor
FRANK SPEETJENS
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
G11CStatic stores11%
H10DInorganic electric semiconductor devices11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H10BElectronic memory devices5%
PatentTitleYear
12,463,129Conductive interconnects and methods of forming conductive interconnects202512,382,633Microelectronic devices including a selectively removable cap dielectric material, methods of forming the microelectronic devices, and related systems202512,347,732Systems and methods for mitigating crack propagation in semiconductor die manufacturing202511,978,527Conductive interconnects and methods of forming conductive interconnects202411,637,040Systems and methods for mitigating crack propagation in semiconductor die manufacturing202311,545,391Conductive interconnects and methods of forming conductive interconnects202311,328,749Conductive interconnects and methods of forming conductive interconnects2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to MICRON TECHNOLOGY INC (7)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 7 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2022–2025 |