Inventor
Taturou Yamashita
Inventor
Satsuma-gun, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H05KPrinted circuits43%
Y02PClimate change mitigation technologies in the production or processing of goods7%
PatentTitleYear
6,347,037'Semiconductor device and method of forming the same'20026,184,133'Method of forming an assembly board with insulator filled through holes'20016,088,233'Semiconductor device and assembly board having through-holes filled with filling core'20005,978,222'Semiconductor device and assembly board having through-holes filled with filling core'19995,889,333'Semiconductor device and method for manufacturing such'19995,729,435'Semiconductor device and assembly board having through-holes filled with filling core'19985,726,493'Semiconductor device and semiconductor device unit having ball-grid-array type package structure'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2002Patents assigned to FUJITSU LTD (7)· patent assignee history
1998–2002Based in Satsuma-gun, JP· patent location history
1998–2000Based in Kagoshima, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 7 | 1998–2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Satsuma-gun, JP | 5 | 1998–2002 |
| Kagoshima, JP | 2 | 1998–2000 |