Inventor
Nobuaki Miyamoto
Inventor
Hitachi, JP
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
Y10TTechnical subjects covered by former us classification12%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form10%
C25DProcesses for the electrolytic or electrophoretic production of coatings10%
A43BCharacteristic features of footwear4%
A47LDomestic washing or cleaning4%
B29DProducing particular articles from plastics or from substances in a plastic state4%
C01GCompounds containing metals not covered by subclasses c01d or c01f2%
PatentTitleYear
10,356,898Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device201910,349,531Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method201910,299,385Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device201910,251,283Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device20199,955,583Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board20188,230,591'Method for fabricating an electronic device substrate'20128,230,588'Method of making an electronic device and electronic device substrate'20128,101,864'Electronic device substrate and its fabrication method, and electronic device and its fabrication method'20127,939,935'Electronic device substrate, electronic device and methods for fabricating the same'20117,880,091'Electronic device substrate, electronic device and methods for making same'20117,780,836'Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same'20107,705,245'Electronic device substrate and its fabrication method, and electronic device and its fabrication method'20107,681,310'Method for fabricating double-sided wiring board'20104,402,931'Process for producing manganese dioxide'1983Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1983Based in Arao, JP· patent location history
2010–2012Patents assigned to HITACHI CABLE (8)· patent assignee history
2010–2012Based in Hitachi, JP· patent location history
2011–2012Patents assigned to RENESAS ELECTRONICS CORP (5)· patent assignee history
2012Patents assigned to CHINDA AKIRA (3)· patent assignee history
2012Patents assigned to HIRASAWA KOKI (3)· patent assignee history
2012Based in Tokyo, JP· patent location history
2018–2019Patents assigned to JX NIPPON MINING & METALS CORP (5)· patent assignee history
2018–2019Based in Ibaraki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI CABLE | 8 | 2010–2012 |
| JX NIPPON MINING & METALS CORP | 5 | 2018–2019 |
| RENESAS ELECTRONICS CORP | 5 | 2011–2012 |
| CHINDA AKIRA | 3 | 2012 |
| HIRASAWA KOKI | 3 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hitachi, JP | 6 | 2010–2012 |
| Ibaraki, JP | 5 | 2018–2019 |
| Tokyo, JP | 2 | 2012 |
| Arao, JP | 1 | 1983 |