Inventor
Kenji Iwade
Inventor
Hiratsuka, JP
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1036%
B24BMachines, devices, or processes for grinding or polishing32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H01LSemiconductor devices9%
C09KMaterials for miscellaneous applications, not provided for elsewhere5%
PatentTitleYear
10,121,677Manufacturing method of semiconductor device20189,558,961'Manufacturing method of semiconductor device'20178,748,289'Method for manufacturing semiconductor device'20148,641,480'Polishing apparatus and polishing method'20148,492,276'Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method'20138,445,360'Method for manufacturing semiconductor device'20138,292,694'Substrate holding mechanism, substrate polishing apparatus and substrate polishing method'20127,883,394'Substrate holding mechanism, substrate polishing apparatus and substrate polishing method'20117,419,420'Substrate holding mechanism, substrate polishing apparatus and substrate polishing method'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2017Patents assigned to TOSHIBA KK (7)· patent assignee history
2008–2014Patents assigned to EBARA CORP (6)· patent assignee history
2008–2014Based in Hiratsuka, JP· patent location history
2012–2014Patents assigned to IWADE KENJI (4)· patent assignee history
2012–2014Patents assigned to TOGAWA TETSUJI (3)· patent assignee history
2013–2014Patents assigned to ITO KENYA (2)· patent assignee history
2014Based in Tokyo, JP· patent location history
2017–2018Based in Mie, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOSHIBA KK | 7 | 2008–2017 |
| EBARA CORP | 6 | 2008–2014 |
| IWADE KENJIself | 4 | 2012–2014 |
| TOGAWA TETSUJI | 3 | 2012–2014 |
| ITO KENYA | 2 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hiratsuka, JP | 6 | 2008–2014 |
| Mie, JP | 2 | 2017–2018 |
| Tokyo, JP | 1 | 2014 |