Inventor
Masachika Masuda
Inventor
Tokorozawa, JP
Overview
Patents· 85 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H05KPrinted circuits10%
G06KGraphical data reading9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
G11CStatic stores8%
Y10TTechnical subjects covered by former us classification6%
B82YSpecific uses or applications of nanostructures5%
H01LSemiconductor devices4%
Y02PClimate change mitigation technologies in the production or processing of goods2%
H10DInorganic electric semiconductor devices1%
PatentTitleYear
9,870,983'Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device'20189,543,169'Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device'20179,324,636'Resin-sealed semiconductor device and associated wiring and support structure'2016RE045931'Method of manufacturing a semiconductor device'20169,263,374'Semiconductor device and manufacturing method therefor'20169,257,306'Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device'20169,159,706'Semiconductor device and a method of manufacturing the same'20158,853,864'Semiconductor device and a method of manufacturing the same'20148,796,832'Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device'20148,739,401'Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member'20148,742,554'Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member'20148,653,647'Plastic package and method of fabricating the same'20148,502,395'Semiconductor device and a method of manufacturing the same'20138,471,371'Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device'20138,420,446'Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit member'20138,247,888'Semiconductor device and method for manufacturing metallic shielding plate'20128,159,062'Semiconductor and a method of manufacturing the same'20128,148,804'Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device'20128,067,251'Semiconductor device and a method of manufacturing the same'20117,879,647'Semiconductor device and a method of manufacturing the same'20117,851,902'Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device'20107,633,146'Semiconductor device and a method of manufacturing the same'20097,405,468'Plastic package and method of fabricating the same'20087,365,441'Semiconductor device fabricating apparatus and semiconductor device fabricating method'20087,348,668'Semiconductor device and method of manufacturing the same'20087,294,918'Memory card with connecting portions for connection to an adapter'20077,271,475'Memory card with connecting portions for connection to an adapter'20077,271,471'Metal substrate apparatus, method of manufacturing an IC card module apparatus, and an IC card module apparatus'20077,239,011'Memory card with a cap having indented portions'20077,233,058'Memory card with an adaptor'20077,227,251'Semiconductor device and a memory system including a plurality of IC chips in a common package'20077,122,883'Stacked semiconductor device including improved lead frame arrangement'20067,064,011'Semiconductor device fabricating apparatus and semiconductor device fabricating method'20067,061,105'Semiconductor device and a method of manufacturing the same'20067,053,471'Memory card'20067,012,321'Stacked semiconductor device including improved lead frame arrangement'20066,924,547'Memory card'20056,885,092'Semiconductor device and a memory system including a plurality of IC chips in a common package'20056,858,925'Semiconductor device and a method of manufacturing the same'20056,853,089'Semiconductor device and method of manufacturing the same'20056,797,539'Method of manufacturing a semiconductor device'20046,750,080'Semiconductor device and process for manufacturing the same'20046,686,663'Semiconductor device and a method of manufacturing the same'20046,617,196'Semiconductor device'20036,610,561'Method of fabricating a semiconductor device'20036,602,734'Method of manufacturing a semiconductor device'20036,576,498'Semiconductor device and a method of manufacturing the same'20036,576,994'Semiconductor device'20036,555,918'Stacked semiconductor device including improved lead frame arrangement'20036,552,437'Semiconductor device and method of manufacture thereof'20036,545,349'Semiconductor device'20036,538,331'Semiconductor device and a method of manufacturing the same'20036,531,773'Semiconductor device'20036,501,183'Semiconductor device and a method of manufacturing the same and an electronic device'20026,501,173'Semiconductor device'20026,492,727'Semiconductor device'20026,452,266'Semiconductor device'20026,433,421'Semiconductor device'20026,410,987'Semiconductor device and a method of manufacturing the same and an electronic device'20026,392,295'Semiconductor device'20026,388,318'Surface mount-type package of ball grid array with multi-chip mounting'20026,383,845'Stacked semiconductor device including improved lead frame arrangement'20026,337,521'Semiconductor device and a method of manufacturing the same'20026,335,227'Method of fabricating a lead-on-chip (LOC) semiconductor device'20026,297,544'Semiconductor device and method for manufacturing the same'20016,297,545'Semiconductor device'20016,285,074'Semiconductor device'20016,252,299'Stacked semiconductor device including improved lead frame arrangement'20016,201,297'Semiconductor device'20016,169,325'Semiconductor device'20016,153,922'Semiconductor device'20006,137,159'Lead on chip semiconductor device and method of fabricating the same'20006,097,081'Semiconductor device having adhesive between lead and chip'20006,064,112'Resin-molded semiconductor device having a lead on chip structure'20005,895,969'Thin type semiconductor device, module structure using the device and method of mounting the device on board'19995,811,877'Semiconductor device structure'19985,723,903'Thin type semiconductor device, module structure using the device and method of mounting the device on board'19985,446,313'Thin type semiconductor device and module structure using the device'19955,150,193'Resin-encapsulated semiconductor device having a particular mounting structure'19924,994,411'Process of producing semiconductor device'19914,989,068'Semiconductor device and method of manufacturing the same'19914,987,474'Semiconductor device and method of manufacturing the same'19914,951,120'Lead frame and semiconductor device using the same'19904,862,246'Semiconductor device lead frame with etched through holes'19894,706,105'Semiconductor device and method of producing the same'1987Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1987–2004Patents assigned to HITACHI LTD (42)· patent assignee history
1987–1992Based in Kodaira, JP· patent location history
1995–2018Based in Tokorozawa, JP· patent location history
2000–2006Patents assigned to HITACHI ULSI SYS CO LTD (23)· patent assignee history
2006–2014Based in Shinjuku-ku, JP· patent location history
2007–2018Patents assigned to DAINIPPON PRINTING CO LTD (17)· patent assignee history
2007–2014Patents assigned to ELPIDA MEMORY INC (8)· patent assignee history
2008–2016Based in Tokyo, JP· patent location history
2011–2016Patents assigned to MASUDA MASACHIKA (12)· patent assignee history
2014Based in Saitama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 42 | 1987–2004 |
| HITACHI ULSI SYS CO LTD | 23 | 2000–2006 |
| DAINIPPON PRINTING CO LTD | 17 | 2007–2018 |
| MASUDA MASACHIKAself | 12 | 2011–2016 |
| ELPIDA MEMORY INC | 8 | 2007–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokorozawa, JP | 68 | 1995–2018 |
| Kodaira, JP | 7 | 1987–1992 |
| Shinjuku-ku, JP | 5 | 2006–2014 |
| Tokyo, JP | 3 | 2008–2016 |
| Saitama, JP | 1 | 2014 |