Inventor
Howard Victor Mahaney, Jr.
Inventor
Cedar Park, TX, US
Overview
Patents· 55 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits28%
G01RMeasuring electric variables13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
Y10TTechnical subjects covered by former us classification10%
B23PMetal-working not otherwise provided for6%
G06FElectric digital data processing6%
F04DNon-positive-displacement pumps5%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application3%
H04BTransmission3%
F05DIndexing scheme for aspects relating to non-positive-displacement machines or engines, gas-turbines or jet-propulsion plants2%
PatentTitleYear
11,041,500Parallel-series hybrid fan cooling apparatus and optimization202111,035,371Parallel-series hybrid fan cooling apparatus and optimization202110,842,051Acoustical noise reduction and distributed airflow in electrical equipment202010,267,340Concentrically symmetric connector in blind mate round fan assembly201910,257,957Cooling system for electronic devices employing adjacent fan cages with interflow passages201910,244,662Method and apparatus for acoustical noise reduction and distributed airflow201910,167,878Cooling fan coupled with a set of recirculation flaps201910,167,879Cooling fan coupled with a set of recirculation flaps20199,788,460'Heatsink providing equivalent cooling for multiple in-line modules'20179,681,579'Cooling system for electronic devices employing adjacent fan cages with interflow passages'20179,631,880'Process for optimizing a heat exchanger configuration'20179,492,899'Multi-rack, door-mounted heat exchanger'20169,354,001'Process for optimizing a heat exchanger configuration'20169,321,136'Multi-rack, door-mounted heat exchanger'20169,314,886'Multi-rack, door-mounted heat exchanger'20168,953,316'Container-based data center having greater rack density'20158,941,993'Heat exchanger door for an electronics rack'20158,929,075'Heat exchanger door for an electronics rack'20158,919,143'Air-cooling wall with slidable heat exchangers'20148,903,565'Operating efficiency of a rear door heat exchanger'20148,804,334'Multi-rack, door-mounted heat exchanger'20148,789,384'Computer rack cooling using independently-controlled flow of coolants through a dual-section heat exchanger'20148,693,199'Structural configuration of a heat exchanger door for an electronics rack'20148,693,198'Structural configuration of a heat exchanger door for an electronics rack'20148,385,069'Liquid coolant conduit secured in an unused socket for memory module cooling'20138,116,080'Container-based data center having greater rack density'20127,969,736'System for cooling memory modules'20117,660,116'Rack with integrated rear-door heat exchanger'20107,508,676'Cold plate structure and method for cooling planar arrays of processors during assembly and test allowing for single module site reworkability'20097,479,796'Functional and stress testing of LGA devices'20097,466,155'Functional and stress testing of LGA devices'20087,463,017'Functional and stress testing of LGA devices'20087,458,733'Compact optical transceivers including thermal distributing and electromagnetic shielding systems and methods therefor'20087,456,644'Functional and stress testing of LGA devices'20087,453,279'Functional and stress testing of LGA devices'20087,425,822'Functional and stress testing of LGA devices'20087,423,440'Functional and stress testing of LGA devices'20087,405,583'Functional and stress testing of LGA devices'20087,352,200'Functional and stress testing of LGA devices'20087,314,318'Compact optical transceivers including thermal distributing and electromagnetic shielding systems and methods thereof'20087,218,129'System, apparatus and method for controlling temperature of an integrated circuit under test'20077,135,877'Temperature and condensation control system for functional tester'20067,073,960'Compact optical transceivers including thermal distributing and electromagnetic shielding systems and methods thereof'20066,911,836'Apparatus for functional and stress testing of exposed chip land grid array devices'20056,765,397'Apparatus and method for testing land grid array modules'20046,661,661'Common heatsink for multiple chips and modules'20036,246,581'Heated PCB interconnect for cooled IC chip modules'20016,243,268'Cooled IC chip modules with an insulated circuit board'20016,233,960'Spot cooling evaporator cooling system for integrated circuit chip modules'20016,233,959'Dehumidified cooling assembly for IC chip modules'20016,198,629'Circuit board and computer system for enhanced cooling'20016,180,874'High density heatsink attachment and method therefor'20016,122,926'Low thermal conductance insulated cooling assembly for IC chip modules'20006,125,036'Moisture barrier seals for cooled IC chip module assemblies'20005,808,236'High density heatsink attachment'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2021Patents assigned to IBM (47)· patent assignee history
1998–2021Based in Cedar Park, TX, US· patent location history
2013–2017Patents assigned to MAHANEY JR HOWARD V (8)· patent assignee history
2014–2017Patents assigned to LENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD (9)· patent assignee history
2014–2017Patents assigned to ECKBERG ERIC A (7)· patent assignee history
2014–2017Patents assigned to MEGARITY WILLIAM M (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 47 | 1998–2021 |
| LENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD | 9 | 2014–2017 |
| MAHANEY JR HOWARD Vself | 8 | 2013–2017 |
| ECKBERG ERIC A | 7 | 2014–2017 |
| MEGARITY WILLIAM M | 5 | 2014–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cedar Park, Texas, US | 55 | 1998–2021 |