Inventor
You Wang
Inventor
Cupertino, CA, US
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
B24BMachines, devices, or processes for grinding or polishing8%
C23CCoating metallic material8%
B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool6%
Y10TTechnical subjects covered by former us classification6%
C25DProcesses for the electrolytic or electrophoretic production of coatings5%
C25FProcesses for the electrolytic removal of materials from objects5%
C04BLime, magnesia4%
C09KMaterials for miscellaneous applications, not provided for elsewhere4%
PatentTitleYear
10,786,885Thin plastic polishing article for CMP applications20209,073,169'Feedback control of polishing using optical detection of clearance'20158,642,121'Thermal interface material having a patterned carbon nanotube array and method for making the same'20148,586,481'Chemical planarization of copper wafer polishing'20138,437,136'Thermal interface material and method of using the same and electronic assembly having the same'20138,221,667'Method for making thermal interface material'20128,210,900'Dishing and defect control of chemical mechanical polishing using real-time adjustable additive delivery'20128,081,469'Thermal interface material and method of using the same and electronic assembly having the same'20117,879,255'Method and composition for electrochemically polishing a conductive material on a substrate'20117,670,688'Erosion-resistant components for plasma process chambers'20107,582,564'Process and composition for conductive material removal by electrochemical mechanical polishing'20097,576,007'Method for electrochemically mechanically polishing a conductive material on a substrate'20097,504,018'Electrochemical method for Ecmp polishing pad conditioning'20097,422,982'Method and apparatus for electroprocessing a substrate with edge profile control'20087,344,432'Conductive pad with ion exchange membrane for electrochemical mechanical polishing'20087,214,297'Substrate support element for an electrochemical plating cell'20076,723,674'Multi-component ceramic compositions and method of manufacture thereof'20046,689,424'Solid lubricant coatings produced by thermal spray methods'20046,652,991'Ductile NiAl intermetallic compositions'20036,639,783'Multi-layer ceramic electrostatic chuck with integrated channel'20036,583,980'Substrate support tolerant to thermal expansion stresses'20036,538,872'Electrostatic chuck having heater and method'20036,503,368'Substrate support having bonded sections and method'20036,490,145'Substrate support pedestal'20026,490,146'Electrostatic chuck bonded to base with a bond layer and method'20026,462,928'Electrostatic chuck having improved electrical connector and method'20026,310,755'Electrostatic chuck having gas cavity and method'20016,094,334'Polymer chuck with heater and method of manufacture'20006,055,150'Multi-electrode electrostatic chuck having fuses in hollow cavities'20005,635,084'Method for creating a corrosion-resistant surface on an aluminum-copper alloy'19975,582,654'Method for creating a corrosion-resistant surface on aluminum alloys having a high copper content'19965,194,138'Method for creating a corrosion-resistant aluminum surface'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–1997Based in Jingshou, CN· patent location history
2000–2020Patents assigned to APPLIED MATERIALS INC (22)· patent assignee history
2000–2020Based in Cupertino, CA, US· patent location history
2004Based in Gilbert, AZ, US· patent location history
2004Based in Storrs, CT, US· patent location history
2011–2014Patents assigned to DAI FENG-WEI (4)· patent assignee history
2011–2014Patents assigned to HON HAI PREC IND CO LTD (4)· patent assignee history
2011–2014Patents assigned to UNIV TSINGHUA (4)· patent assignee history
2011–2014Patents assigned to WANG JI-CUN (4)· patent assignee history
2011–2014Based in Beijing, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 22 | 2000–2020 |
| DAI FENG-WEI | 4 | 2011–2014 |
| HON HAI PREC IND CO LTD | 4 | 2011–2014 |
| UNIV TSINGHUA | 4 | 2011–2014 |
| WANG JI-CUN | 4 | 2011–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cupertino, California, US | 21 | 2000–2020 |
| Beijing, CN | 4 | 2011–2014 |
| Jingshou, CN | 3 | 1993–1997 |
| Gilbert, AZ, US | 1 | 2004 |
| Storrs, CT, US | 1 | 2004 |