Inventor
DE-YANG CHIOU
Inventor
TW
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices26%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H10DInorganic electric semiconductor devices10%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices8%
B82YSpecific uses or applications of nanostructures3%
G02BOptical elements, systems or apparatus3%
PatentTitleYear
12,581,923Method for removing edge of substrate in semiconductor structure202612,532,716Low thermal budget dielectric for semiconductor devices202612,360,314Photonic semiconductor-on-insulator (SOI) substrate and method for forming the photonic SOI substrate202512,347,717Debonding structures for wafer bonding202512,341,056Method of fabricating a semiconductor structure and semiconductor structure obtained therefrom202512,315,837Storage layers for wafer bonding202512,230,585Photolithography alignment process for bonded wafers202511,942,358Low thermal budget dielectric for semiconductor devices202411,942,447Storage layers for wafer bonding202411,916,022Photolithography alignment process for bonded wafers202411,362,038Photolithography alignment process for bonded wafers2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (11)· patent assignee history
2022–2026Based in TW· patent location history
2024Patents assigned to TAIWAN SEMINCONDUCTOR MFG CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 11 | 2022–2026 |
| TAIWAN SEMINCONDUCTOR MFG CO LTD | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 11 | 2022–2026 |