LexDanaLexDanabeta
Inventor

Tomohiro Tamaki

Inventor
Kanagawa, JP

Overview

28→
Patents
1994–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 28 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary
H10DInorganic electric semiconductor devices40%
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
Y10TTechnical subjects covered by former us classification5%
H05KPrinted circuits3%
PatentTitleYear
10,892,351Semiconductor device202110,700,184Semiconductor device202010,418,470Semiconductor device having IGBT portion and diode portion201910,347,713Semiconductor device having a triple region resurf structure201910,083,957Semiconductor device20189,825,163'Power MOSFET, an IGBT, and a power diode'20179,786,736'Power semiconductor device'20179,761,582'Semiconductor device and method of manufacturing semiconductor device'20179,660,070'Power superjunction MOSFET device with resurf regions'20179,536,943'Vertical power MOSFET'20179,391,071'Semiconductor device'20169,379,235'Semiconductor device including a MOSFET and having a super-junction structure'20169,269,767'Power superjunction MOSFET device with resurf regions'20169,166,036'Power MOSFET, an IGBT, and a power diode'20159,093,288'Power superjunction MOSFET device with resurf regions'20159,041,070'Vertical power MOSFET'20158,987,819'Semiconductor device'20158,981,469'Power semiconductor device'20158,796,787'Semiconductor device'20148,786,046'Semiconductor device and method for manufacturing the same'20148,598,657'Semiconductor device'20138,575,707'Semiconductor power device having a super-junction structure'20138,558,309'Power semiconductor device'20138,350,325'Power semiconductor device'20137,886,798'Expanding method and expanding device'20117,887,665'Expanding method and expanding device'20115,526,563'Method for manufacturing an electronic component'19965,316,610'Bonding apparatus'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–1996Based in Osaka, JP· patent location history
2013–2017Patents assigned to RENESAS ELECTRONICS CORP (17)· patent assignee history
2013–2015Patents assigned to TAMAKI TOMOHIRO (4)· patent assignee history
2013Patents assigned to NAKAZAWA YOSHITO (3)· patent assignee history
2013–2017Based in Kanagawa, JP· patent location history
2016–2021Patents assigned to TOSHIBA KK (7)· patent assignee history
2016–2021Based in Nonoichi Ishikawa, JP· patent location history
2017Based in Ishikawa, JP· patent location history
2017Based in Tokyo, JP· patent location history
2019–2020Patents assigned to TOSHIBA ELECTRONIC DEVICES & STORAGE CORP (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
RENESAS ELECTRONICS CORP172013–2017
TOSHIBA KK72016–2021
TAMAKI TOMOHIROself42013–2015
NAKAZAWA YOSHITO32013
TOSHIBA ELECTRONIC DEVICES & STORAGE CORP32019–2020
Locations
LocationPatentsSpan
Kanagawa, JP162013–2017
Nonoichi Ishikawa, JP62016–2021
Osaka, JP21994–1996
Ishikawa, JP12017
Tokyo, JP12017