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Inventor

Ligong Wang

Inventor
Seattle, WA, US

Overview

4→
Patents
2019–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G06Fprimary
G06FElectric digital data processing22%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use22%
B24BMachines, devices, or processes for grinding or polishing11%
H01HElectric switches11%
H02JElectric power networks11%
H04LTransmission of digital information, e.g. telegraphic communication11%
H05KPrinted circuits11%
PatentTitleYear
11,069,501Miniature super surface mount fuse and manufacturing method thereof202110,983,785Firmware updating of power units202110,965,148Datacenter backup power management202110,513,003Precision lapping and polishing device for external cylindrical surface of the disk part and its taper error adjustment method thereof2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019Patents assigned to UNIV DALIAN TECH (1)· patent assignee history
2019Based in Dalian, CN· patent location history
2021Patents assigned to AMAZON TECH INC (2)· patent assignee history
2021Patents assigned to AEM COMPONENTS SUZHOU CO LTD (1)· patent assignee history
2021Based in Seattle, WA, US· patent location history
2021Based in San Diego, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
AMAZON TECH INC22021
AEM COMPONENTS SUZHOU CO LTD12021
UNIV DALIAN TECH12019
Locations
LocationPatentsSpan
Seattle, Washington, US22021
San Diego, California, US12021
Dalian, CN12019