Inventor
Toshifumi Kojima
Inventor
Komaki, JP
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
Y10TTechnical subjects covered by former us classification17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
B23KSoldering or unsoldering9%
G02BOptical elements, systems or apparatus9%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients2%
H01BCables2%
PatentTitleYear
7,484,897'Optical module, optical module substrate and optical coupling structure'20097,438,969'Filling material, multilayer wiring board, and process of producing multilayer wiring board'20087,404,680'Optical module, optical module substrate and optical coupling structure'20087,221,829'Substrate assembly for supporting optical component and method of producing the same'20077,183,497'Multilayer wiring board'20077,150,569'Optical device mounted substrate assembly'20066,876,091'Wiring board'20056,822,170'Embedding resin and wiring substrate using the same'20046,770,965'Wiring substrate using embedding resin'20046,740,411'Embedding resin, wiring substrate using same and process for producing wiring substrate using same'20046,680,123'Embedding resin'20046,586,827'Wiring board and method for fabricating the same'20036,512,182'Wiring circuit board and method for producing same'20036,193,910'Paste for through-hole filling and printed wiring board using the same'20014,988,035'Method of liquid phase diffusion bonding of metal bodies'19914,238,659'Preventing magnetization of pipe blank in GMA welding'19804,110,589'Method for longitudinally seam-welding pipe-blank for welded steel pipe from the inside along a groove'19784,107,503'Method for eliminating residual magnetism in pipe-blank for welded steel pipe longitudinally seam-welded from inside'1978Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1978–1991Patents assigned to NIPPON KOKAN KK (4)· patent assignee history
1978–1980Based in Yokohama, JP· patent location history
1991Based in Tokyo, JP· patent location history
2001–2009Patents assigned to NGK SPARK PLUG CO (13)· patent assignee history
2001–2008Based in Komaki, JP· patent location history
2003–2009Based in Aichi, JP· patent location history
2006Patents assigned to NOR SPARK PLUG CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NGK SPARK PLUG CO | 13 | 2001–2009 |
| NIPPON KOKAN KK | 4 | 1978–1991 |
| NOR SPARK PLUG CO LTD | 1 | 2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Komaki, JP | 8 | 2001–2008 |
| Aichi, JP | 6 | 2003–2009 |
| Yokohama, JP | 3 | 1978–1980 |
| Tokyo, JP | 1 | 1991 |